Inventor · disambiguated record
Kwong-Hin Henry Choy
Also filed as: CHOY KWONG-HIN HENRY
20 granted patents·3 pending applications·17 citations·filing 2012–2022
91Inventor score
Top patents by PatentIndex Score
23 records- 0189US11067879B2Ultra-dense LED projector using thinned gallium nitrideTECTUS CORP·Filed 2020·Granted Jul 20, 2021·2 cites·19 claims
- 0286US10768515B2Method for manufacturing ultra-dense LED projector using thinned gallium nitrideSPY EYE LLC·Filed 2018·Granted Sep 8, 2020·4 cites·24 claims
- 0385US10134965B2Passivation for a semiconductor light emitting deviceKONINKLIJKE PHILIPS NV·Filed 2016·Granted Nov 20, 2018·3 cites·13 claims
- 0479US9246061B2LED having vertical contacts redistruted for flip chip mountingLEI JIPU·Filed 2012·Granted Jan 26, 2016·6 cites·9 claims
- 0576US11658273B2Passivation for a semiconductor light emitting deviceLUMILEDS LLC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 0671US11289624B2Control of p-contact resistance in a semiconductor light emitting deviceLUMILEDS LLC·Filed 2020·Granted Mar 29, 2022·0 cites·16 claims
- 0771US9478712B2Light emitting structure and mountKONINKLIJKE PHILIPS NV·Filed 2014·Granted Oct 25, 2016·1 cites·10 claims
- 0870US11127881B2Ultra-dense array of LEDs with half cavities and reflective sidewallsTECTUS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·17 claims
- 0969US11158669B2Ultra-dense array of LEDs with half cavities and reflective sidewalls, and manufacturing methodsTECTUS CORP·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 1069US10873013B2Passivation for a semiconductor light emitting deviceLUMILEDS LLC·Filed 2018·Granted Dec 22, 2020·0 cites·14 claims
- 1169US10134805B2Light emitting structure and mountLUMILEDS LLC·Filed 2016·Granted Nov 20, 2018·1 cites·10 claims
- 1268US11038082B2Method of separating light emitting devices formed on a substrate waferLUMILEDS LLC·Filed 2020·Granted Jun 15, 2021·0 cites·18 claims
- 1361US11038081B2Method of separating light emitting devices formed on a substrate waferLUMILEDS LLC·Filed 2018·Granted Jun 15, 2021·0 cites·12 claims
- 1459US2018294379A1Control of p-contact resistance in a semiconductor light emitting deviceLUMILEDS LLC·Filed 2018·Application pending·0 cites
- 1558US9991419B2Control of P-contact resistance in a semiconductor light emitting deviceLUMILEDS LLC·Filed 2016·Granted Jun 5, 2018·0 cites·11 claims
- 1658US9490131B2Control of P-contact resistance in a semiconductor light emitting deviceKONINKLIJKE PHILIPS NV·Filed 2014·Granted Nov 8, 2016·0 cites·11 claims
- 1757US12324285B2Ultra-dense array of LEDs with ruthenium mirrorsTECTUS CORP·Filed 2022·Granted Jun 3, 2025·0 cites·19 claims
- 1857US10079327B2Method of separating light emitting devices formed on a substrate waferLUMILEDS LLC·Filed 2014·Granted Sep 18, 2018·0 cites·14 claims
- 1952US11626551B1Bonding ultra-dense bump arrays using alignment bumpsTECTUS CORP·Filed 2021·Granted Apr 11, 2023·0 cites·22 claims
- 2052US9722137B2LED having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2016·Granted Aug 1, 2017·0 cites·6 claims
- 2152US2018019370A1Led having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2017·Application pending·0 cites
- 2250US11476387B2Ultra-dense array of LEDs with half cavities and reflective sidewalls, and hybrid bonding methodsTECTUS CORP·Filed 2021·Granted Oct 18, 2022·0 cites·20 claims
- 2350US2016155901A1Highly reflective flip chip led dieKONINKL PHILIPS NV·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →