Inventor · disambiguated record

Kwang Soon Hwang

Also filed as: HWANG KWANG SOON

2 granted patents·2 citations·filing 2006–2006

38Inventor score

Technology areasH10W

Files withHWANG KWANG SOON1 STATS CHIPPAC LTD1

Top patents by PatentIndex Score

2 records

0154US7863737B2Integrated circuit package system with wire bond patternSTATS CHIPPAC LTD·Filed 2006·Granted Jan 4, 2011·1 cites·20 claims
0247US8410594B2Inter-stacking module systemHWANG KWANG SOON·Filed 2006·Granted Apr 2, 2013·1 cites·8 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →