Inventor · disambiguated record
Kwan-Jai Lee
Also filed as: LEE KWAN-JAI
12 granted patents·4 pending applications·930 citations·filing 1999–2016
93Inventor score
Top patents by PatentIndex Score
16 records- 0197US6448661B1Three-dimensional multi-chip package having chip selection pads and manufacturing method thereofSAMSUNG ELECTORNICS CO LTD·Filed 2002·Granted Sep 10, 2002·420 cites·14 claims
- 0295US6849949B1Thin stacked packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 1, 2005·108 cites·26 claims
- 0394US8853694B2Chip on film package including test pads and semiconductor devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 7, 2014·20 cites·11 claims
- 0494US6087722AMulti-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 11, 2000·260 cites·11 claims
- 0593US6878570B2Thin stacked package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 12, 2005·83 cites·12 claims
- 0691US9113545B2Tape wiring substrate and chip-on-film package including the sameHAN SANG-UK·Filed 2012·Granted Aug 18, 2015·15 cites·16 claims
- 0780US9280182B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 8, 2016·5 cites·20 claims
- 0878US9059162B2Chip on film (COF) substrate, COF package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 16, 2015·5 cites·20 claims
- 0963US8629547B2Semiconductor chip packageCHO KYONG-SOON·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 1060US7339262B2Tape circuit substrate and semiconductor apparatus employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 4, 2008·8 cites·39 claims
- 1151US7247936B2Tape circuit substrate having wavy beam leads and semiconductor chip package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 24, 2007·4 cites·39 claims
- 1248US2016162091A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1338US8803301B2Semiconductor packageCHO KYONG-SOON·Filed 2012·Granted Aug 12, 2014·0 cites·20 claims
- 1438US2004263667A1Solid-state imaging apparatus and method for making the sameFiled 2004·Application pending·0 cites
- 1537US2012021600A1Method of fabricating film circuit substrate and method of fabricating chip package including the sameHAN SANG-UK·Filed 2011·Application pending·0 cites
- 1636US2002084519A1Semiconductor chip stack package and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →