Inventor · disambiguated record
Kwi-Jong Lee
Also filed as: LEE KWI JONG
24 granted patents·27 pending applications·152 citations·filing 2004–2020
95Inventor score
Top patents by PatentIndex Score
51 records- 0197US7559970B2Method for producing metal nanoparticles and metal nanoparticles produced therebySAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 14, 2009·47 cites·11 claims
- 0292US7591872B1Method for producing silver nanoparticles and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·13 cites·11 claims
- 0388US7744834B2Method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 29, 2010·13 cites·17 claims
- 0488US7505247B2Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 17, 2009·16 cites·7 claims
- 0586US7593214B2Array type multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·13 cites·12 claims
- 0685US8388725B2Apparatus and method for manufacturing metal nanoparticlesLEE YOUNG-IL·Filed 2010·Granted Mar 5, 2013·5 cites·7 claims
- 0779US7931730B2Method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 26, 2011·5 cites·14 claims
- 0875US7881039B2Multi-layer ceramic capacitor having improved component capacity and production method thereofSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 1, 2011·6 cites·7 claims
- 0974US7648654B2Nonaqueous conductive nanoink compositionSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 19, 2010·5 cites·4 claims
- 1070US7671514B2Electroactive solid-state actuator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 2, 2010·10 cites·7 claims
- 1167US7593215B2Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·3 cites·14 claims
- 1262US8004822B2Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2009·Granted Aug 23, 2011·1 cites·5 claims
- 1361US7867316B2Method of manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 11, 2011·6 cites·12 claims
- 1460US11688546B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 27, 2023·0 cites·14 claims
- 1560US9090635B2Copper organic metal, method for preparing copper organic metal and copper pasteSAMSUNG ELECTRO MECH·Filed 2012·Granted Jul 28, 2015·0 cites·2 claims
- 1660US2010078604A1Nickel nanoparticlesSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1757US8158031B2Method for preparing metal nanoparticles using metal seed and metal nanoparticles comprising metal seedLEE KWI-JONG·Filed 2009·Granted Apr 17, 2012·3 cites·6 claims
- 1857US7935169B2Apparatus and method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted May 3, 2011·4 cites·13 claims
- 1956US11721468B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 8, 2023·0 cites·15 claims
- 2056US11211193B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 28, 2021·0 cites·13 claims
- 2156US7648556B2Method for manufacturing nickel nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 19, 2010·0 cites·15 claims
- 2256US2014049874A1Metal powder, electronic component and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2356US2011267738A1Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2453US2016141116A1Metal powder, electronic component and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2552US8187504B2Copper nanoparticle dispersionLEE YOUNG IL·Filed 2009·Granted May 29, 2012·0 cites·6 claims
- 2652US2014023779A1Conductive copper paste composition and method of forming metal thin film using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2751US2009308645A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2851US2010020466A1Array type multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2951US2015284412A1Method for preparing copper organic metal and copper pasteSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3050US2010031848A1Alloy nanoparticles of sn-cu-ag, preparation method thereof and ink or paste using the alloy nanoparticlesSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3150US2006203423A1Multi-layer ceramic capacitor and production method thereofLEE KWI-JONG·Filed 2006·Application pending·0 cites
- 3249US8496873B2Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticlesLEE KWI-JONG·Filed 2012·Granted Jul 30, 2013·0 cites·11 claims
- 3349US2009110619A1Apparatus for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3448US2007190323A1Method of producing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3548US2008138643A1Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3648US2015028983A1Chip electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3748US2009025510A1Method for manufacturing nickel nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3848US2011236646A1Ink composition, metal thin film prepared using the same and method of preparing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3948US2008282537A1Wiring forming method of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4047US2007275259A1Method of producing metal nanoparticles and metal nanoparticles produced therebySAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 4147US2011129607A1Substitutional electroless gold plating solution and method for forming gold plating layer using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4246US2006254387A1Metal nano particle and method for manufacturing them and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4345US2013164553A1Copper powder, copper paste and method for preparing copper powderSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4445US2006261316A1Conductive ink, preparation method thereof and conductive boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4544US8173210B2Methods for surface modification of non-dispersible metal nanoparticles and modified metal nanoparticles for inkjet by the same methodSHIM IN-KEUN·Filed 2007·Granted May 8, 2012·0 cites·17 claims
- 4644US2013280158A1Method of producing copper precursor and copper precursor produced by using the sameKWON JI HAN·Filed 2012·Application pending·0 cites
- 4742US7276091B2Method of producing polymer capacitor by forming micropore in ion exchange membrane and polymer capacitor produced therebySAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 2, 2007·2 cites·11 claims
- 4841US2006213603A1Multi-layer ceramic electronic component and production method thereofLEE KWI-JONG·Filed 2006·Application pending·0 cites
- 4938US2016189874A1Electrode structure for capacitor, electrolytic capacitor, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 5037US2011151117A1Organic metal complexes for forming metal thin layer, ink including the same and method for forming metal thin layer using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →