Inventor · disambiguated record
Kwangjin Moon
Also filed as: MOON KWANGJIN
53 granted patents·17 pending applications·94 citations·filing 2011–2025
97Inventor score
Top patents by PatentIndex Score
70 records- 0197US11380607B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 5, 2022·4 cites·20 claims
- 0296US11749587B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 5, 2023·3 cites·20 claims
- 0396US11721628B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·10 cites·20 claims
- 0494US11749586B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·20 claims
- 0594US11342221B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·4 cites·19 claims
- 0692US11295981B2Semiconductor devices including through vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·3 cites·20 claims
- 0790US12249558B2Semiconductor device including penetration via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 11, 2025·1 cites·12 claims
- 0890US11362067B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0988US9852965B2Semiconductor devices with through electrodes and methods of fabricating the sameLEE HO-JIN·Filed 2016·Granted Dec 26, 2017·6 cites·20 claims
- 1085US10103098B2Semiconductor devices including a through via structure and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 16, 2018·5 cites·19 claims
- 1184US8836142B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 16, 2014·7 cites·16 claims
- 1282US9153559B2Semiconductor devices including through silicon via electrodes and methods of fabricating the sameLEE DOSUN·Filed 2012·Granted Oct 6, 2015·8 cites·19 claims
- 1381US12334477B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1481US11791137B2Apparatus for etching substrate bevel and semiconductor fabrication method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·1 cites·15 claims
- 1581US2025293212A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1680US11004814B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 1780US9214374B2Semiconductor devices including stress relief structuresLEE DOSUN·Filed 2012·Granted Dec 15, 2015·10 cites·26 claims
- 1879US11664316B2Semiconductor devices having penetration vias with portions having decreasing widthsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 30, 2023·1 cites·11 claims
- 1979US11348892B2Semiconductor devices including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·1 cites·19 claims
- 2078US10049997B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 14, 2018·3 cites·28 claims
- 2178US9847276B2Semiconductor devices having through-electrodes and methods for fabricating the sameKANG PIL-KYU·Filed 2014·Granted Dec 19, 2017·5 cites·14 claims
- 2277US12424572B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2373US9673133B2Semiconductor devices having through-electrodesPARK JAE-HWA·Filed 2015·Granted Jun 6, 2017·2 cites·20 claims
- 2471US11887957B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 2571US11887966B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 2671US8872351B2Semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·3 cites·6 claims
- 2771US2024274509A1Semiconductor device including through-electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2871US2025183121A1Semiconductor device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2970US12300671B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 3070US2024153851A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3169US12046538B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 3269US11581279B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 3369US8691692B2Semiconductor chips and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 8, 2014·2 cites·9 claims
- 3469US8551860B2Semiconductor devices having through electrodes and methods of fabricating the sameBANG SUKCHUL·Filed 2012·Granted Oct 8, 2013·3 cites·15 claims
- 3568US12347781B2Semiconductor devices having penetration viasSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 3668US11728245B2Semiconductor device and semiconductor package including penetration via structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 3768US9153522B2Semiconductor devices and methods of fabricating the sameMOON KWANGJIN·Filed 2013·Granted Oct 6, 2015·2 cites·28 claims
- 3867US10109665B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 23, 2018·1 cites·15 claims
- 3966US12476234B2Semiconductor device including through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 4066US11908775B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·11 claims
- 4166US11791211B2Semiconductor devices including through vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 4265US11824035B2Method of manufacturing a semiconductor device including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·18 claims
- 4364US11694980B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·9 claims
- 4463US11961788B2Semiconductor device including through-electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·13 claims
- 4563US11538782B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·0 cites·23 claims
- 4663US11315894B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·21 claims
- 4763US8710650B2Semiconductor devices having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 29, 2014·1 cites·11 claims
- 4861US11600553B2Semiconductor device including through substrate vias and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 4959US11810900B2Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 5058US11101196B2Semiconductor device including through substrate vias and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·18 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →