Inventor · disambiguated record
Kwangwuk Park
Also filed as: PARK KWANGWUK
6 granted patents·1 pending application·8 citations·filing 2020–2022
72Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0193US11735498B2Through via electrode and device isolation structure including oxide layer pattern and nitride layer pattern sequentially stacked on inner surface of trenchSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·4 cites·19 claims
- 0290US11380606B2Semiconductor device including via structure with head and body portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·18 claims
- 0381US11791242B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·1 cites·20 claims
- 0466US11798866B2Semiconductor device including via structures with undercut portions and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 0561US2023178434A1Semiconductor device, semiconductor package, and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0657US11848285B2Semiconductor chip including buried dielectric pattern at edge region, semiconductor package including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 0746US11749614B2Through-silicon via (TSV) key for overlay measurement, and semiconductor device and semiconductor package including TSV keySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Kwangwuk Park files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →