Inventor · disambiguated record
Kwang Hong Tan
Also filed as: TAN KWANG HONG
8 granted patents·173 citations·filing 2002–2020
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0193US6720666B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 13, 2004·91 cites·53 claims
- 0292US9099340B2Power management applications of interconnect substratesVOLTERRA SEMICONDUCTOR CORP·Filed 2012·Granted Aug 4, 2015·12 cites·37 claims
- 0388US9520342B2Power management applications of interconnect substratesVOLTERRA SEMICONDUCTOR CORP·Filed 2015·Granted Dec 13, 2016·5 cites·19 claims
- 0488US6692987B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·60 cites·74 claims
- 0570US10332827B2Power management application of interconnect substratesVOLTERRA SEMICONDUCTOR CORP·Filed 2016·Granted Jun 25, 2019·1 cites·25 claims
- 0662US10748845B2Power management application of interconnect substratesVOLTERRA SEMICONDUCTOR CORP·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 0754US11296019B1Vertically structured pad systemMAXIM INTEGRATED PRODUCTS·Filed 2020·Granted Apr 5, 2022·0 cites·20 claims
- 0850US7112048B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·4 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →