Inventor · disambiguated record
Kwang Yeun Won
Also filed as: WON KWANG YEUN
11 granted patents·1 citations·filing 2021–2023
77Inventor score
Technology areasH01G
Files withSAMSUNG ELECTRO MECH11
Top patents by PatentIndex Score
11 records- 0181US11842853B2Multilayered electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 12, 2023·1 cites·14 claims
- 0268US12456579B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Oct 28, 2025·0 cites·27 claims
- 0358US12278056B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Apr 15, 2025·0 cites·16 claims
- 0457US12224126B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 11, 2025·0 cites·21 claims
- 0556US11996240B2Electronic component having a body and sealing thin film disposed in a microhole of the bodySAMSUNG ELECTRO MECH·Filed 2021·Granted May 28, 2024·0 cites·17 claims
- 0655US12112892B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 8, 2024·0 cites·30 claims
- 0753US12255022B2Multilayer electronic component having insulating layer which includes fluorine-based organic materialSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 18, 2025·0 cites·35 claims
- 0853US12224127B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 11, 2025·0 cites·34 claims
- 0951US12374497B2Multilayer electronic component with improved reliabilitySAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 29, 2025·0 cites·27 claims
- 1051US12249461B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 11, 2025·0 cites·33 claims
- 1150US12354803B2Multilayer electronic component having structure for improved adhesion force and moisture protectionSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 8, 2025·0 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →