Inventor · disambiguated record

Kwangbok Woo

Also filed as: WOO KWANGBOK

2 granted patents·2 pending applications·0 citations·filing 2021–2025

25Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD4

Top patents by PatentIndex Score

4 records

0174US2025372500A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
0262US12406917B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
0358US2025176104A1Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0448US11749592B2Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →