Inventor · disambiguated record
Kwang-Su Yu
Also filed as: YU KWANG-SU
7 granted patents·4 pending applications·133 citations·filing 1998–2011
85Inventor score
Top patents by PatentIndex Score
11 records- 0181US6062799AApparatus and method for automatically loading or unloading printed circuit boards for semiconductor modulesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted May 16, 2000·55 cites·16 claims
- 0280US5927504AApparatus for carrying plural printed circuit boards for semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 27, 1999·52 cites·10 claims
- 0377US8189342B2Printed circuit board for memory module, method of manufacturing the same and memory module/socket assemblyBANG HYO-JAE·Filed 2006·Granted May 29, 2012·8 cites·10 claims
- 0477US7521788B2Semiconductor module with conductive element between chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·8 cites·30 claims
- 0568US8616907B2Test socket for testing electrical characteristics of a memory moduleKIM JUNG-HOON·Filed 2011·Granted Dec 31, 2013·6 cites·20 claims
- 0665US7576437B2Printed circuit board of semiconductor package and method for mounting semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·3 cites·16 claims
- 0746US2007181993A1Printed circuit board including reinforced copper plated film and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0844US2007172690A1Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0941US7061768B2Open socketSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 13, 2006·1 cites·8 claims
- 1039US2006043578A1Semiconductor device having heat sinkBANG HYO-JAE·Filed 2005·Application pending·0 cites
- 1137US2011079872A1Passive device, semiconductor module, electronic circuit board, and electronic system having the passive device, and methods of fabricating and inspecting the semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →