Inventor · disambiguated record
Kyutaro Abe
Also filed as: ABE KYUTARO
3 granted patents·4 pending applications·9 citations·filing 2012–2016
60Inventor score
Top patents by PatentIndex Score
7 records- 0176US9078358B2Assembly structure for injection molded substrate and for mounting componentTORATANI TOMOAKI·Filed 2012·Granted Jul 7, 2015·6 cites·10 claims
- 0265US9837728B2Electrical wire with terminal, and wire harness structureFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Dec 5, 2017·2 cites·8 claims
- 0352US9755325B2Terminal, wire harness, terminal and coated conductor wire connection method, and wire harness structureFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Sep 5, 2017·1 cites·5 claims
- 0444US2014008105A1Circuit board and method for manufacturing circuit boardFURUKAWA AUTOMOTIVE SYS INC·Filed 2013·Application pending·0 cites
- 0543US2013033842A1Board and method for manufacturing boardFURUKAWA AUTOMOTIVE SYS INC·Filed 2012·Application pending·0 cites
- 0642US2013033350A1Substrate and substrate production methodFURUKAWA AUTOMOTIVE SYS INC·Filed 2012·Application pending·0 cites
- 0735US2012267152A1Substrate and method of manufacturing substrateHARA TOSHITAKA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →