Inventor · disambiguated record
Kyle Arrington
Also filed as: ARRINGTON KYLE · ARRINGTON KYLE J · ARRINGTON KYLE JORDAN
16 granted patents·59 pending applications·8 citations·filing 2019–2025
87Inventor score
Top patents by PatentIndex Score
75 records- 0192US12238892B2Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2020·Granted Feb 25, 2025·3 cites·15 claims
- 0286US11622466B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2020·Granted Apr 4, 2023·2 cites·21 claims
- 0383US12266589B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0483US11616000B2Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface materialINTEL CORP·Filed 2021·Granted Mar 28, 2023·1 cites·25 claims
- 0577US12057369B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 0675US2025191998A1Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2025·Application pending·0 cites
- 0773US12349303B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0870US11842944B2IC assemblies including die perimeter frames suitable for containing thermal interface materialsINTEL CORP·Filed 2019·Granted Dec 12, 2023·2 cites·22 claims
- 0968US12091484B2Copolymer compatibilizers and uses thereofVIRGINIA TECH INTELLECTUAL PROPERTIES INC·Filed 2019·Granted Sep 17, 2024·0 cites·20 claims
- 1068US11854935B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 1167US2024270929A1Capillary underfill formulations that include carbon nanotubes, containers, and methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 1261US2025014967A1Methods and apparatus to improve thermal dissipation and mechanical loading of integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1361US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 1459US2024264530A1Light responsive photoresists and methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 1559US2025386432A1Coaxial vias in glass core architecturesINTEL CORP·Filed 2024·Application pending·0 cites
- 1658US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 1758US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 1957US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2057US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2157US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 2257US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2357US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2457US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2557US2025218880A1Microelectronic assemblies with pillar-first conductive via formation in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2657US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2757US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 2856US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 2956US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3056US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 3156US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 3256US2025218957A1Methods and apparatus to embed a semiconductor device in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3355US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3455US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 3555US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 3654US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3754US2024222136A1Electrical layer with roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 3854US2024312865A1Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 3954US2024332125A12d fillers for reduced cte for pidINTEL CORP·Filed 2023·Application pending·0 cites
- 4053US2024213116A1Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 4153US2024213169A1Low die height glass substrate device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4253US2024222210A1Glass substrate fabrication using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4353US2024222238A1Apparatus and method for attaching an optical component using no remelt metallurgyINTEL CORP·Filed 2022·Application pending·0 cites
- 4453US2024219660A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4553US2024222345A1Die attach in glass core package through organic-to-organic bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4653US2024219654A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4753US2024112971A1Singulation of integrated circuit package substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 4853US2024222243A1Apparatus and method for attaching an optical component using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4953US2024222304A1Methods and apparatus to reduce solder bump bridging between two substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 5053US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 75 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →