Inventor · disambiguated record
Kyoung Chul Bae
Also filed as: BAE KYOUNG CHUL
1 granted patent·5 pending applications·0 citations·filing 2007–2025
4Inventor score
Top patents by PatentIndex Score
6 records- 0144US2025236760A1Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the sameSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 0236US2025368838A1Epoxy resin composition for encapsulating multichip package and multichip package encapsulated using the sameSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 0335US10636712B2Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed by using sameSAMSUNG SDI CO LTD·Filed 2015·Granted Apr 28, 2020·0 cites·9 claims
- 0430US2008131702A1Epoxy resin composition and semiconductor package including the sameBAE KYOUNG CHUL·Filed 2007·Application pending·0 cites
- 0525US2012168968A1Epoxy resin composition for encapsulating a semiconductor device, method of encapsulating a semiconductor device, and semiconductor deviceLEE YOUNG KYUN·Filed 2011·Application pending·0 cites
- 0616US2014179832A1Epoxy resin composition for encapsulating a semiconductor device and semiconductor device encapsulated using the sameBAE KYOUNG CHUL·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →