Inventor · disambiguated record
Kyle Bothe
Also filed as: BOTHE KYLE
20 granted patents·27 pending applications·38 citations·filing 2014–2024
91Inventor score
Top patents by PatentIndex Score
47 records- 0196US10971612B2High electron mobility transistors and power amplifiers including said transistors having improved performance and reliabilityCREE INC·Filed 2019·Granted Apr 6, 2021·21 cites·21 claims
- 0291US11749726B2Field effect transistor with source-connected field plateWOLFSPEED INC·Filed 2021·Granted Sep 5, 2023·2 cites·33 claims
- 0390US11658234B2Field effect transistor with enhanced reliabilityWOLFSPEED INC·Filed 2021·Granted May 23, 2023·2 cites·24 claims
- 0488US11791389B2Radio frequency transistor amplifiers having widened and/or asymmetric source/drain regions for improved on-resistance performanceWOLFSPEED INC·Filed 2021·Granted Oct 17, 2023·2 cites·26 claims
- 0588US10923585B2High electron mobility transistors having improved contact spacing and/or improved contact viasCREE INC·Filed 2019·Granted Feb 16, 2021·6 cites·19 claims
- 0684US11502178B2Field effect transistor with at least partially recessed field plateWOLFSPEED INC·Filed 2020·Granted Nov 15, 2022·1 cites·45 claims
- 0783US12224318B2Radio frequency transistor amplifiers having self-aligned double implanted source/drain regions for improved on-resistance performance and related methodsWOLFSPEED INC·Filed 2022·Granted Feb 11, 2025·1 cites·27 claims
- 0881US11842937B2Encapsulation stack for improved humidity performance and related fabrication methodsCREE INC·Filed 2021·Granted Dec 12, 2023·1 cites·25 claims
- 0978US12015075B2Methods of manufacturing high electron mobility transistors having a modified interface regionWOLFSPEED INC·Filed 2021·Granted Jun 18, 2024·1 cites·21 claims
- 1070US10811370B2Packaged electronic circuits having moisture protection encapsulation and methods of forming sameCREE INC·Filed 2018·Granted Oct 20, 2020·1 cites·23 claims
- 1165US11682634B2Packaged electronic circuits having moisture protection encapsulation and methods of forming sameWOLFSPEED INC·Filed 2020·Granted Jun 20, 2023·0 cites·16 claims
- 1265US11616136B2High electron mobility transistors and power amplifiers including said transistors having improved performance and reliabilityWOLFSPEED INC·Filed 2021·Granted Mar 28, 2023·0 cites·24 claims
- 1360US12113114B2Transistor with ohmic contactsWOLFSPEED INC·Filed 2021·Granted Oct 8, 2024·0 cites·26 claims
- 1459US2024162304A1Field effect transistor including field platesMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2024·Application pending·0 cites
- 1558US12382699B2Plasma-based barrier layer removal method for increasing peak transconductance while maintaining on-state resistance and related devicesMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Aug 5, 2025·0 cites·28 claims
- 1658US2025275210A1Transistor Design Reducing Use of GoldMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2024·Application pending·0 cites
- 1757US2025142915A1Group iii-nitride high-electron mobility transistors configured with a low resistance contact layer for source and/or drain contacts and process for implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1856US2025185277A1Multi-gate switch field effect transistorWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1956US2024429120A1Topside Cooling for Semiconductor DeviceWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2056US2024429122A1Thermally conductive interposer, a device implementing a thermally conductive interposer, and processes for implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2155US2024266419A1Semiconductor Device Having Semiconductor Structure with Polarity Inverting LayerWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2255US2024421193A1Low Contact Resistance in Semiconductor Devices with Implanted RegionsWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2355US2024429230A1Integrated resistors with increased sheet resistance for rf applications and methods of fabricating the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2454US12266721B2Field effect transistor with multiple stepped field plateWOLFSPEED INC·Filed 2022·Granted Apr 1, 2025·0 cites·27 claims
- 2554US2025098199A1Corrosion Resistant Metal Structures for Wide Bandgap Semiconductor DevicesWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2654US2024274507A1Vias for Semiconductor Devices Formed from Multiple EtchingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2754US2024105824A1Barrier Structure for Sub-100 Nanometer Gate Length DevicesWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 2854US2024429314A1Implantation for Isolated Channel Structures in Group III-Nitride Semiconductor DevicesWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2954US2024120202A1Implanted Regions for Semiconductor Structures with Deep Buried LayersWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 3053US2024072732A1Transistor die including matching circuitWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 3153US2024290847A1Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor DevicesWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 3253US2024105823A1Barrier Structure for Dispersion Reduction in Transistor DevicesWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 3353US2024290876A1Nitrogen-Polar Group III-Nitride Semiconductor Device with Isolation Implant RegionsWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 3452US12464759B2High electron mobility transistors having reduced drain current drift and methods of fabricating such devicesMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 3552US2024072125A1Electronic devices with reduced ohmic to ohmic dimensionsWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 3652US2025142918A1Group iii-nitride high-electron mobility transistors configured with a low resistance contact layer for source and/or drain contacts and process for implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 3751US12446252B2Transistors including semiconductor surface modification and related fabrication methodsMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2021·Granted Oct 14, 2025·0 cites·34 claims
- 3851US12408403B2Field effect transistor with stacked unit subcell structureMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Sep 2, 2025·0 cites·31 claims
- 3951US2024313099A1Metal stack with phonon scattering layer that forms a non-ohmic contact to a semiconductor layerWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 4050US12009417B2High electron mobility transistors having improved performanceMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2021·Granted Jun 11, 2024·0 cites·29 claims
- 4150US2024194751A1Transistor devices including self-aligned ohmic contacts and contact regions and related fabrication methodsWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 4250US2016315196A1Buried source schottky barrier thin film transistor and method of manufactureUNIV ALBERTA·Filed 2014·Application pending·0 cites
- 4348US12218202B2Semiconductor device incorporating a substrate recessWOLFSPEED INC·Filed 2021·Granted Feb 4, 2025·0 cites·13 claims
- 4446US2023029763A1Interconnect metal openings through dielectric filmsCREE INC·Filed 2021·Application pending·0 cites
- 4545US2017250287A1Buried source schottky barrier thin transistor and method of manufactureUNIV ALBERTA·Filed 2017·Application pending·0 cites
- 4643US2024178311A1High Frequency, High Temperature Transistor DevicesWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 4743US2021359118A1Group III-Nitride High-Electron Mobility Transistors Configured with Recessed Source and/or Drain Contacts for Reduced On State Resistance and Process for Implementing the SameCREE INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →