Inventor · disambiguated record
Kyle B. Campbell
Also filed as: CAMPBELL KYLE B
11 granted patents·2 pending applications·46 citations·filing 2014–2024
87Inventor score
Files withMICRON TECHNOLOGY INC13
Top patents by PatentIndex Score
13 records- 0196US11094699B1Apparatuses including stacked horizontal capacitor structures and related methods, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 17, 2021·21 cites·21 claims
- 0293US10249819B2Methods of forming semiconductor structures including multi-portion linersMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 2, 2019·13 cites·19 claims
- 0386US11355348B2Integrated circuit, construction of integrated circuitry, and method of forming an arrayMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 7, 2022·2 cites·9 claims
- 0486US9401474B2Methods of forming structuresMICRON TECHNOLOGY INC·Filed 2014·Granted Jul 26, 2016·6 cites·11 claims
- 0583US10665782B2Methods of forming semiconductor structures including multi-portion linersMICRON TECHNOLOGY INC·Filed 2018·Granted May 26, 2020·2 cites·18 claims
- 0678US9761797B2Methods of forming structuresMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·2 cites·21 claims
- 0771US11050020B2Methods of forming devices including multi-portion linersMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 29, 2021·0 cites·20 claims
- 0871US10879462B2Devices including multi-portion linersMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 0964US12010827B2Apparatuses including capacitors and related systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 1060US10658580B2Semiconductor structures including multi-portion linersMICRON TECHNOLOGY INC·Filed 2017·Granted May 19, 2020·0 cites·24 claims
- 1160US2024332229A1Semiconductor device with dual damascene and dummy padsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1254US2024107748A1Staggered horizontal cell architecture for memory devicesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1351US10692727B2Integrated circuit, construction of integrated circuitry, and method of forming an arrayMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 23, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →