Inventor · disambiguated record
Kyu-Hwan Chang
Also filed as: CHANG KYU HWAN
12 granted patents·4 pending applications·564 citations·filing 1994–2023
92Inventor score
Top patents by PatentIndex Score
16 records- 0194US5624498AShowerhead for a gas supplying apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Apr 29, 1997·292 cites·15 claims
- 0293US6513538B2Method of removing contaminants from integrated circuit substrates using cleaning solutionsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 4, 2003·95 cites·20 claims
- 0389US6638855B1Method of filling contact hole of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 28, 2003·73 cites·13 claims
- 0471US6607654B2Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnectSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 19, 2003·15 cites·19 claims
- 0571US6277204B1Methods for cleaning wafers used in integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 21, 2001·14 cites·8 claims
- 0670US6537876B2Method of manufacturing a semiconductor capacitor having a hemispherical grain layer using a dry cleaning processSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 25, 2003·15 cites·21 claims
- 0770US6335287B1Method of forming trench isolation regionsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 1, 2002·14 cites·17 claims
- 0859US12412767B2Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0959US6162671AMethod of forming capacitors having high dielectric constant materialSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Dec 19, 2000·25 cites·13 claims
- 1059US6092539AIn-situ cleaning apparatuses for wafers used in integrated circuit devices and methods of cleaning using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 25, 2000·21 cites·21 claims
- 1157US12237180B2Apparatus for treating substrateSEMES CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·16 claims
- 1251US2023339790A1Ozone water decomposition apparatus and methodSEMES CO LTD·Filed 2022·Application pending·0 cites
- 1349US2024042493A1Spray unit and substrate treatment apparatus including the sameSEMES CO LTD·Filed 2023·Application pending·0 cites
- 1449US2023033534A1Apparatus for treating substrateSEMES CO LTD·Filed 2022·Application pending·0 cites
- 1548US12489000B2Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·14 claims
- 1630US2002045355A1Method of manufacturing a semiconductor device having a silicide layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →