Inventor · disambiguated record
Kyoo-Chul Cho
Also filed as: CHO KYOO-CHUL
19 granted patents·9 pending applications·258 citations·filing 1997–2014
94Inventor score
Top patents by PatentIndex Score
28 records- 0192US9035309B23D CMOS image sensors, sensor systems including the samePARK YOUNG-SOO·Filed 2011·Granted May 19, 2015·10 cites·18 claims
- 0289US6045610AMethods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnanceSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 4, 2000·102 cites·54 claims
- 0385US9359382B2β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 7, 2016·2 cites·2 claims
- 0481US6552337B1Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurementsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 22, 2003·31 cites·18 claims
- 0579US5944889AMethods of heat-treating semiconductor wafersSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 31, 1999·63 cites·8 claims
- 0674US7964907B2Integrated circuit device gate structuresSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jun 21, 2011·5 cites·13 claims
- 0771US9359383B2β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 7, 2016·0 cites·6 claims
- 0871US8268397B2Organometallic precursor, thin film having the same, metal wiring including the thin film, method of forming a thin film and method of manufacturing a metal wiring using the sameCHO YOUN-JOUNG·Filed 2008·Granted Sep 18, 2012·4 cites·8 claims
- 0971US7648854B2Methods of forming metal oxide layers, methods of forming gate structures using the same, and methods of forming capacitors using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 19, 2010·3 cites·19 claims
- 1068US6724474B1Wafer surface inspection methodSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 20, 2004·17 cites·14 claims
- 1167US7550347B2Methods of forming integrated circuit device gate structuresSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 23, 2009·3 cites·23 claims
- 1266US7488684B2Organic aluminum precursor and method of forming a metal wire using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·2 cites·8 claims
- 1364US7573123B2Semiconductor device and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 11, 2009·3 cites·9 claims
- 1461US7452569B2Organic aluminum precursor and method of manufacturing a metal wiring using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·2 cites·7 claims
- 1558US7675091B2Semiconductor wafer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 9, 2010·2 cites·8 claims
- 1653US2012251724A1Beta-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the sameCHO YOUN-JOUNG·Filed 2012·Application pending·0 cites
- 1747US6472040B1Semi-pure and pure monocrystalline silicon ingots and wafersSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Oct 29, 2002·5 cites·4 claims
- 1846US2009096014A1Nonvolatile memory devices that include an insulating film with nanocrystals embedded therein and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1945US2008246077A1Method of fabricating semiconductor memory device and semiconductor memory device fabricated by the methodSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2043US2005016470A1Susceptor and deposition apparatus including the sameFiled 2004·Application pending·0 cites
- 2142US2008057224A1Method of forming a thin film and methods of manufacturing a gate structure and a capacitor using sameCHO YOUN-JOUNG·Filed 2007·Application pending·0 cites
- 2241US7372150B2Semiconductor wafer having identification indicationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 13, 2008·1 cites·17 claims
- 2341US2005259246A1Apparatus for inspecting a surface and methods thereofKANG TAE-SOO·Filed 2005·Application pending·0 cites
- 2440US2009233439A1Method of forming an ohmic layer and method of forming a metal wiring of a semiconductor device using the samePARK MYUNG-BEOM·Filed 2009·Application pending·0 cites
- 2540US2007246775A1Soi substrate and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2639US2007232041A1Integrated circuit device gate structures having charge storing nano crystals in a metal oxide dielectric layer and methods of forming the sameCHOI SAM-JONG·Filed 2006·Application pending·0 cites
- 2733US6919214B2Apparatus for analyzing a substrate employing a copper decorationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 19, 2005·0 cites·19 claims
- 2832US6170235B1Wafer packaging methodSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jan 9, 2001·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →