Inventor · disambiguated record
Kyongsoon Cho
Also filed as: CHO KYONGSOON
15 granted patents·5 pending applications·50 citations·filing 2013–2025
89Inventor score
Top patents by PatentIndex Score
20 records- 0192US9177904B2Chip-on-film package and device assembly including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·16 cites·12 claims
- 0288US11574943B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·20 claims
- 0387US9978694B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·12 cites·17 claims
- 0485US9818732B2Chip-on-film package and device assembly including the sameJUNG JAE-MIN·Filed 2015·Granted Nov 14, 2017·6 cites·13 claims
- 0583US2025358935A1Semiconductor packages having circuit boardsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0682US10937771B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·3 cites·17 claims
- 0781US10347611B2Semiconductor packages having redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·4 cites·19 claims
- 0880US9241407B2Tape film packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 19, 2016·4 cites·11 claims
- 0973US12389545B2Semiconductor packages having circuit boardsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 1070US12243886B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1167US9620389B2Methods of fabricating tape film packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 11, 2017·1 cites·10 claims
- 1262US9883593B2Semiconductor modules and semiconductor packagesCHO KYONGSOON·Filed 2015·Granted Jan 30, 2018·2 cites·12 claims
- 1358US11894405B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·19 claims
- 1453US2024006434A1Image sensor package including a chip stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1550US12471401B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 1649US9313889B2Display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 12, 2016·0 cites·17 claims
- 1749US2023027390A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1848US9468102B2Display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 11, 2016·0 cites·18 claims
- 1937US2014367659A1Display devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2031US2016379937A1Substrate stripSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →