Inventor · disambiguated record
Kyoung-Bok Cho
Also filed as: CHO KYOUNG BOK
4 granted patents·4 pending applications·44 citations·filing 1999–2017
75Inventor score
Top patents by PatentIndex Score
8 records- 0186US10692833B2Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 23, 2020·8 cites·13 claims
- 0277US6863109B2In-line die attaching and curing apparatus for a multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 8, 2005·25 cites·19 claims
- 0362US7074646B2In-line die attaching and curing apparatus for a multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 11, 2006·10 cites·17 claims
- 0461US10016833B2Solder ball mounterSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 10, 2018·1 cites·8 claims
- 0536US2018229329A1Bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 0630US2003145939A1Dual die bonder for a semiconductor device and a method thereofFiled 2002·Application pending·0 cites
- 0729US2011079361A1Apparatus for semiconductor die bondingPARK BYEONG-KUK·Filed 2010·Application pending·0 cites
- 0826US2001002569A1Apparatus for cutting adhesive tape mounted on semiconductor waferFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →