Inventor · disambiguated record
Kyoungsei Choi
Also filed as: CHOI KYOUNGSEI
23 granted patents·1 pending application·111 citations·filing 2009–2023
94Inventor score
Top patents by PatentIndex Score
24 records- 0197US10177188B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·41 cites·17 claims
- 0293US12062605B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·1 cites·20 claims
- 0391US9425156B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 23, 2016·11 cites·22 claims
- 0489US11367688B2Semiconductor package with interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0586US8940584B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 27, 2015·8 cites·13 claims
- 0683US10825776B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·18 claims
- 0783US8692349B2Semiconductor devices and methods of controlling temperature thereofKIM JAE CHOON·Filed 2011·Granted Apr 8, 2014·7 cites·35 claims
- 0883US8350158B2Tape wiring substrates and packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 8, 2013·11 cites·13 claims
- 0982US11367679B2Semiconductor package including an in interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·1 cites·20 claims
- 1081US8748228B2Semiconductor packages and methods of forming the sameKIM TONGSUK·Filed 2012·Granted Jun 10, 2014·8 cites·10 claims
- 1180US11482554B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·11 claims
- 1280US9355931B2Package-on-package devices and methods of manufacturing the sameKIM JONGKOOK·Filed 2014·Granted May 31, 2016·8 cites·14 claims
- 1378US10756055B2Stacked image sensor package and stacked image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·2 cites·19 claims
- 1476US10211159B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·2 cites·20 claims
- 1575US11658107B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·15 claims
- 1671US10868073B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·18 claims
- 1769US11798889B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1864US9601445B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 21, 2017·1 cites·19 claims
- 1959US8198722B2Semiconductor packageCHO YOUNGSANG·Filed 2009·Granted Jun 12, 2012·3 cites·20 claims
- 2051US10262971B2Stacked image sensor package and stacked image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 16, 2019·0 cites·15 claims
- 2146US11404382B2Semiconductor package including an embedded semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 2246US2014184312A1Semiconductor devices and methods of controlling temperature thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2344US11581263B2Semiconductor package, and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 2444US9112062B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 18, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →