Inventor · disambiguated record
Kyeong Keun Choi
Also filed as: CHOI KYEONG K · CHOI KYEONG KEUN
19 granted patents·4 pending applications·417 citations·filing 1993–2010
95Inventor score
Top patents by PatentIndex Score
23 records- 0191US5637533AMethod for fabricating a diffusion barrier metal layer in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1996·Granted Jun 10, 1997·119 cites·8 claims
- 0279US5670420AMethod of forming metal interconnection layer of semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1995·Granted Sep 23, 1997·61 cites·8 claims
- 0373US6869871B1Method of forming metal line in semiconductor device including forming first and second zirconium filmsHYNIX SEMICONDUCTOR INC·Filed 2003·Granted Mar 22, 2005·15 cites·21 claims
- 0473US6815339B2Method for forming copper metal line in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Nov 9, 2004·16 cites·5 claims
- 0571US5702970AMethod for fabricating a capacitor of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1996·Granted Dec 30, 1997·32 cites·9 claims
- 0670US5427981AProcess for fabricating metal plus using metal silicide filmHYUNDAI ELECTRONICS IND·Filed 1994·Granted Jun 27, 1995·31 cites·11 claims
- 0767US5633201AMethod for forming tungsten plugs in contact holes of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1995·Granted May 27, 1997·36 cites·4 claims
- 0866US7678688B2Method for forming metal interconnection in image sensorCHOI KYEONG-KEUN·Filed 2006·Granted Mar 16, 2010·4 cites·15 claims
- 0964US5714402AMethod for fabricating a capacitor of a semiconductor device and the structure of the sameHYUNDAI ELECTRONICS IND·Filed 1996·Granted Feb 3, 1998·23 cites·16 claims
- 1048US5739049AMethod for fabricating semiconductor device having a capacitor and a method of forming metal wiring on a semiconductor substrateHYUNDAI ELECTRONICS IND·Filed 1996·Granted Apr 14, 1998·14 cites·21 claims
- 1148US5380680AMethod for forming a metal contact of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1993·Granted Jan 10, 1995·18 cites·3 claims
- 1247US5459100AMethod for forming metal wiring of semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1994·Granted Oct 17, 1995·16 cites·4 claims
- 1345US5686358AMethod for forming a plug in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1995·Granted Nov 11, 1997·13 cites·14 claims
- 1439US2010133642A1System and method for forming metal interconnection in image sensorCHOI KYEONG-KEUN·Filed 2010·Application pending·0 cites
- 1538US2005142793A1Method of manufactuing inductor in semiconductor deviceFiled 2004·Application pending·0 cites
- 1637US2004229442A1Method for forming high resistive region in semiconductor deviceFiled 2003·Application pending·0 cites
- 1737US2004152294A1Method for forming metal line of semiconductor deviceFiled 2003·Application pending·0 cites
- 1836US5953576AMethod for fabricating a capacitor of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1997·Granted Sep 14, 1999·4 cites·6 claims
- 1934US6080594AMethod for fabricating a capacitor of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1999·Granted Jun 27, 2000·3 cites·5 claims
- 2032US5837608AMethod of filling a contact hole in a semiconductor device using vertical growth of metalHYUNDAI ELECTRONICS IND·Filed 1997·Granted Nov 17, 1998·3 cites·7 claims
- 2132US5455198AMethod for fabricating tungsten contact plugHYUNDAI ELECTRONICS IND·Filed 1993·Granted Oct 3, 1995·4 cites·5 claims
- 2231US5595936AMethod for forming contacts in semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1995·Granted Jan 21, 1997·3 cites·4 claims
- 2325US6169327B1Metal interconnection structure of semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1998·Granted Jan 2, 2001·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →