Inventor · disambiguated record
Kyoung Moo Harr
Also filed as: HARR KYOUNG MOO
12 granted patents·5 pending applications·45 citations·filing 2012–2019
88Inventor score
Top patents by PatentIndex Score
17 records- 0195US10062652B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 28, 2018·12 cites·18 claims
- 0290US10211149B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 19, 2019·7 cites·20 claims
- 0388US10043758B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 7, 2018·6 cites·14 claims
- 0486US10388614B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 20, 2019·4 cites·18 claims
- 0585US9881873B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 30, 2018·5 cites·13 claims
- 0683US10741461B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·3 cites·8 claims
- 0779US9905526B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 27, 2018·3 cites·20 claims
- 0876US10170382B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 1, 2019·2 cites·12 claims
- 0968US10224288B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 5, 2019·1 cites·8 claims
- 1065US10154594B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 11, 2018·1 cites·11 claims
- 1160US8957319B2Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 17, 2015·1 cites·15 claims
- 1249US2015000958A1Printed circuit board and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1343US10622322B2Fan-out semiconductor package and method of manufacturing the fan-out semiconductorSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 14, 2020·0 cites·12 claims
- 1441US2014042604A1Three-dimensional (3d) semiconductor packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1540US2014186651A1Printed circuit board having copper plated layer with roughness and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1640US2020027833A1Electronic Component PackageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1735US2016198568A1Printed circuit board and electronic component moduleSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →