Inventor · disambiguated record
Kyu-Pyung Hwang
Also filed as: HWANG KYU C · HWANG KYU-PYUNG
38 granted patents·18 pending applications·71 citations·filing 2004–2024
96Inventor score
Top patents by PatentIndex Score
56 records- 0194US10653013B1Thin film resistor having surface mounted trimming bridges for incrementally tuning resistanceBOEING CO·Filed 2019·Granted May 12, 2020·7 cites·20 claims
- 0291US9472425B2Power distribution improvement using pseudo-ESR control of an embedded passive capacitorQUALCOMM INC·Filed 2015·Granted Oct 18, 2016·8 cites·14 claims
- 0390US10903542B1Variable radio frequency attenuatorBOEING CO·Filed 2020·Granted Jan 26, 2021·3 cites·20 claims
- 0486US9933455B2Known good die testing for high frequency applicationsQUALCOMM INC·Filed 2015·Granted Apr 3, 2018·3 cites·6 claims
- 0586US9613942B2Interposer for a package-on-package structureQUALCOMM INC·Filed 2015·Granted Apr 4, 2017·5 cites·28 claims
- 0686US8987872B2Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packagesQUALCOMM INC·Filed 2013·Granted Mar 24, 2015·8 cites·26 claims
- 0782US9275876B2Stiffener with embedded passive componentsQUALCOMM INC·Filed 2013·Granted Mar 1, 2016·5 cites·22 claims
- 0880US10181410B2Integrated circuit package comprising surface capacitor and ground planeQUALCOMM INC·Filed 2015·Granted Jan 15, 2019·3 cites·18 claims
- 0978US9530739B2Package on package (PoP) device comprising a high performance inter package connectionQUALCOMM INC·Filed 2015·Granted Dec 27, 2016·3 cites·30 claims
- 1078US9502490B2Embedded package substrate capacitorQUALCOMM INC·Filed 2014·Granted Nov 22, 2016·4 cites·14 claims
- 1178US9355963B2Semiconductor package interconnections and method of making the sameQUALCOMM INC·Filed 2014·Granted May 31, 2016·4 cites·30 claims
- 1277US9659850B2Package substrate comprising capacitor, redistribution layer and discrete coaxial connectionQUALCOMM INC·Filed 2014·Granted May 23, 2017·4 cites·19 claims
- 1374US9041212B2Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)QUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·27 claims
- 1471US9093295B2Embedded sheet capacitorQUALCOMM INC·Filed 2013·Granted Jul 28, 2015·2 cites·16 claims
- 1570US9385077B2Integrated device comprising coaxial interconnectQUALCOMM INC·Filed 2014·Granted Jul 5, 2016·2 cites·29 claims
- 1669US12016164B1RF filter device for aircraft nacelle access door gapBOEING CO·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 1769US10980122B2Thin film resistor having surface mounted trimming bridges for incrementally tuning resistanceBOEING CO·Filed 2020·Granted Apr 13, 2021·0 cites·20 claims
- 1869US9425143B2Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shieldQUALCOMM INC·Filed 2014·Granted Aug 23, 2016·1 cites·24 claims
- 1968US9490226B2Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signalQUALCOMM INC·Filed 2014·Granted Nov 8, 2016·1 cites·33 claims
- 2067US9628052B2Embedded multi-terminal capacitorQUALCOMM INC·Filed 2014·Granted Apr 18, 2017·2 cites·29 claims
- 2163US9807884B2Substrate comprising embedded elongated capacitorQUALCOMM INC·Filed 2014·Granted Oct 31, 2017·1 cites·19 claims
- 2263US9583433B2Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layerQUALCOMM INC·Filed 2015·Granted Feb 28, 2017·1 cites·20 claims
- 2362US9621281B2Integrated device package and/or system comprising configurable directional optical transmitterQUALCOMM INC·Filed 2014·Granted Apr 11, 2017·1 cites·36 claims
- 2459US11191983B2Fire suppressing deviceBOEING CO·Filed 2018·Granted Dec 7, 2021·0 cites·20 claims
- 2557US2025379672A1Precipitation static aircraft model for antennas interferenceBOEING CO·Filed 2024·Application pending·0 cites
- 2653US11378605B2Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicleBOEING CO·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 2753US9449762B2Embedded package substrate capacitor with configurable/controllable equivalent series resistanceQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·0 cites·9 claims
- 2852US9335384B2Adjustable magnetic probe for efficient near field scanningQUALCOMM INC·Filed 2013·Granted May 10, 2016·0 cites·20 claims
- 2952US9294064B2Bandpass filter implementation on a single layer using spiral capacitorsQUALCOMM INC·Filed 2013·Granted Mar 22, 2016·0 cites·36 claims
- 3052US9269610B2Pattern between pattern for low profile substrateQUALCOMM INC·Filed 2014·Granted Feb 23, 2016·0 cites·30 claims
- 3152US2019057880A1Integrated circuit package comprising surface capacitor and ground planeQUALCOMM INC·Filed 2018·Application pending·0 cites
- 3251US9151779B2Reconfigurable electric field probeQUALCOMM INC·Filed 2012·Granted Oct 6, 2015·0 cites·36 claims
- 3350US9502491B2Embedded sheet capacitorQUALCOMM INC·Filed 2015·Granted Nov 22, 2016·0 cites·30 claims
- 3449US10049977B2Semiconductor package on package structure and method of forming the sameQUALCOMM INC·Filed 2014·Granted Aug 14, 2018·0 cites·5 claims
- 3549US2016322300A1Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shieldQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3649US2015146340A1Multilayer ceramic capacitor including at least one slotQUALCOMM INC·Filed 2013·Application pending·0 cites
- 3748US11038277B2High impedance surface (HIS) enhanced by discrete passivesBOEING CO·Filed 2019·Granted Jun 15, 2021·0 cites·23 claims
- 3848US9875997B2Low profile reinforced package-on-package semiconductor deviceQUALCOMM INC·Filed 2014·Granted Jan 23, 2018·0 cites·23 claims
- 3947US11071213B2Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passivesBOEING CO·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 4046US2016141234A1Integrated device package comprising silicon bridge in photo imageable layerQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4146US2016183379A1Substrate comprising an embedded capacitorQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4246US2016091532A1Flexible film electrical-test substrates with conductive coupling post(s) for integrated circuit (ic) bump(s) electrical testing, and related methods and testing apparatusesQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4345US9837209B2Capacitor structure for wideband resonance suppression in power delivery networksQUALCOMM INC·Filed 2012·Granted Dec 5, 2017·0 cites·30 claims
- 4445US2016055976A1Package substrates including embedded capacitorsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4545US2015294791A1Ceramic interposer capacitorQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4645US2016056226A1Wafer level package (wlp) integrated device comprising electromagnetic (em) passive device in redistribution portion, and radio frequency (rf) shieldQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4744US11462460B2Electrical module assembly with embedded diesBOEING CO·Filed 2019·Granted Oct 4, 2022·0 cites·19 claims
- 4844US10079097B2Capacitor structure for power delivery applicationsQUALCOMM INC·Filed 2015·Granted Sep 18, 2018·0 cites·18 claims
- 4944US2015187731A1Low cost connector for high speed, high density signal deliveryQUALCOMM INC·Filed 2013·Application pending·0 cites
- 5044US2015084653A1Current source driven measurement and modelingQUALCOMM INC·Filed 2013·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →