Inventor · disambiguated record
Kyujin Jung
Also filed as: JUNG KYUJIN
8 granted patents·843 citations·filing 2000–2001
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0197US6342730B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jan 29, 2002·148 cites·8 claims
- 0296US6528893B2Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·117 cites·10 claims
- 0396US6261864B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 17, 2001·124 cites·14 claims
- 0495US6495909B2Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Dec 17, 2002·102 cites·4 claims
- 0595US6401545B1Micro electro-mechanical system sensor with selective encapsulation and method thereforMOTOROLA INC·Filed 2000·Granted Jun 11, 2002·177 cites·30 claims
- 0694US6333252B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Dec 25, 2001·93 cites·8 claims
- 0789US6861295B2Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 1, 2005·51 cites·15 claims
- 0880US6242284B1Method for packaging a semiconductor chipADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 5, 2001·31 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →