Inventor · disambiguated record
Ky-Hyun Jung
Also filed as: JUNG KY-HYUN
4 granted patents·4 pending applications·27 citations·filing 2004–2011
72Inventor score
Top patents by PatentIndex Score
8 records- 0173US7576438B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·5 cites·32 claims
- 0272US7102369B2Contact pin, connection device and method of testingSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 5, 2006·19 cites·24 claims
- 0362US8053351B2Method of forming at least one bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 8, 2011·2 cites·16 claims
- 0459US8039972B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·1 cites·32 claims
- 0549US2009200362A1Method of manufacturing a semiconductor packageJUNG KY-HYUN·Filed 2009·Application pending·0 cites
- 0647US2008061434A1Substrate for semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0745US2008110477A1Cleaning solutions and methods of cleaning boards using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0838US2011293903A1Wave soldering apparatus to apply buoyancy, soldering method, and method of forming solder bumps for flip chips on a substrateJUNG KY-HYUN·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ky-Hyun Jung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →