Inventor · disambiguated record
Kyungmoon Kim
Also filed as: KIM KYUNGMOON
11 granted patents·2 pending applications·46 citations·filing 2013–2020
88Inventor score
Top patents by PatentIndex Score
13 records- 0187US9287204B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2013·Granted Mar 15, 2016·8 cites·25 claims
- 0286US9252130B2Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Feb 2, 2016·10 cites·27 claims
- 0384US9406533B2Methods of forming conductive and insulating layersSTATS CHIPPAC LTD·Filed 2013·Granted Aug 2, 2016·6 cites·25 claims
- 0484US9245770B2Semiconductor device and method of simultaneous molding and thermalcompression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Jan 26, 2016·7 cites·24 claims
- 0581US10418332B2Semiconductor device and method of forming partition fence and shielding layer around semiconductor componentsSTATS CHIPPAC PTE LTD·Filed 2017·Granted Sep 17, 2019·5 cites·22 claims
- 0676US9865575B2Methods of forming conductive and insulating layersSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jan 9, 2018·2 cites·25 claims
- 0776US9240331B2Semiconductor device and method of making bumpless flipchip interconnect structuresSTATS CHIPPAC LTD·Filed 2013·Granted Jan 19, 2016·4 cites·22 claims
- 0875US9721921B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2016·Granted Aug 1, 2017·2 cites·23 claims
- 0964US10699789B2Nonvolatile memory device and memory system including nonvolatile memory device that controls the erase speeds of cell stringsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 30, 2020·2 cites·18 claims
- 1055US11164636B2Nonvolatile memory device and memory system including nonvolatile memory device that controls the erase speeds of cell stringsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 2, 2021·0 cites·10 claims
- 1143US11797711B2Electronic device, method for providing personal information using same, and computer-readable recording medium for recording sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 24, 2023·0 cites·13 claims
- 1243US2015004750A1Methods of Forming Conductive Materials on Contact PadsSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 1335US2017201378A1Electronic device and method for authenticating identification information thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →