Inventor · disambiguated record
Kyoungran Kim
Also filed as: KIM KYOUNGRAN
3 granted patents·5 pending applications·19 citations·filing 2012–2023
64Inventor score
Top patents by PatentIndex Score
8 records- 0188US9553069B2Bonding apparatus and substrate manufacturing equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 24, 2017·10 cites·19 claims
- 0276US9640507B2Bonding method, bonding apparatus, and method for manufacturing substrateHAN ILYOUNG·Filed 2014·Granted May 2, 2017·9 cites·8 claims
- 0353US2024395594A1Apparatus for chucking a waferSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0451US2024347370A1Carrier dechucking system and carrier dechucking method using carrier dechucking systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0549US2023178345A1Method of cleaning chamberKIM KYOUNGRAN·Filed 2022·Application pending·0 cites
- 0647US11581202B2Substrate debonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 0739US2013248114A1Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0839US2013139380A1Chip bonding apparatus and chip bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →