Inventor · disambiguated record

Kyung Hwan Ko

Also filed as: KO KYUNG H · KO KYUNG HWAN

33 granted patents·15 pending applications·51 citations·filing 1999–2024

95Inventor score

Technology areasH04N H05K H10W B22F F21K

Files withSK TELECOM CO LTD23 SAMSUNG ELECTRO MECH18 UNIV SEJONG IND ACAD COOP FOUD3 JANG MIN-SOK2 LUCENT TECHNOLOGIES INC1

Top patents by PatentIndex Score

48 records

0198US10881004B1Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 29, 2020·6 cites·20 claims
0297US11962764B2Inter-prediction method and video decoding apparatus using the sameSK TELECOM CO LTD·Filed 2023·Granted Apr 16, 2024·6 cites·8 claims
0397US11178761B1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 16, 2021·5 cites·26 claims
0496US11671584B2Inter-prediction method and video decoding apparatus using the sameSK TELECOM CO LTD·Filed 2021·Granted Jun 6, 2023·6 cites·8 claims
0588US9999131B2Printed circuit board with embedded electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·6 cites·11 claims
0681US12355949B2Method and device for deriving intra-prediction modeSK TELECOM CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·10 claims
0781US12348709B2Method and device for deriving intra-prediction modeSK TELECOM CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·10 claims
0881US12335466B2Method and device for deriving intra-prediction modeSK TELECOM CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·10 claims
0981US10306778B2Printed circuit board with dam around cavity and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted May 28, 2019·3 cites·20 claims
1080US12375658B2Method of restoration in subblock units, and video decoding apparatusSK TELECOM CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·7 claims
1180US12375659B2Method of restoration in subblock units, and video decoding apparatusSK TELECOM CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·7 claims
1280US12348710B2Method and device for deriving intra-prediction modeSK TELECOM CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·10 claims
1380US12309366B2Method of restoration in subblock units, and video decoding apparatusSK TELECOM CO LTD·Filed 2024·Granted May 20, 2025·0 cites·7 claims
1480US12301802B2Method of restoration in sub-block units, and video decoding apparatusSK TELECOM CO LTD·Filed 2024·Granted May 13, 2025·0 cites·7 claims
1578US10045444B2Printed circuit board, package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 7, 2018·3 cites·18 claims
1677US12323585B2Inter-prediction method and video decoding apparatus using the sameSK TELECOM CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·8 claims
1777US12316835B2Inter-prediction method and video decoding apparatus using the sameSK TELECOM CO LTD·Filed 2024·Granted May 27, 2025·0 cites·8 claims
1877US12309361B2Inter-prediction method and video decoding apparatus using the sameSK TELECOM CO LTD·Filed 2024·Granted May 20, 2025·0 cites·8 claims
1977US12052417B2Method for splitting picture and decoding apparatusSK TELECOM CO LTD·Filed 2020·Granted Jul 30, 2024·1 cites·8 claims
2077US9999141B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·2 cites·10 claims
2176US11439021B2Electronic component-embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 6, 2022·1 cites·22 claims
2276US11129280B2Electronic component-embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 21, 2021·1 cites·17 claims
2375US10925161B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 16, 2021·2 cites·16 claims
2474US2024430450A1Method for adaptively setting resolution, and image decoding apparatusSK TELECOM CO LTD·Filed 2024·Application pending·0 cites
2574US2025008116A1Method for adaptively setting resolution, and image decoding apparatusSK TELECOM CO LTD·Filed 2024·Application pending·0 cites
2674US2025008117A1Method for adaptively setting resolution, and image decoding apparatusSK TELECOM CO LTD·Filed 2024·Application pending·0 cites
2774US2024430451A1Method for adaptively setting resolution, and image decoding apparatusSK TELECOM CO LTD·Filed 2024·Application pending·0 cites
2869US10998247B2Board with embedded passive componentSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 4, 2021·1 cites·19 claims
2967US12058313B2Intra mode candidate configuration method and video decoding apparatusSK TELECOM CO LTD·Filed 2020·Granted Aug 6, 2024·0 cites·13 claims
3066US11991350B2Method and device for deriving intra-prediction modeSK TELECOM CO LTD·Filed 2020·Granted May 21, 2024·0 cites·10 claims
3166US11956427B2Method of restoration in subblock units, and video decoding apparatusSK TELECOM CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·7 claims
3264US9848492B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 19, 2017·1 cites·4 claims
3353US2021058646A1Video signal processing method and deviceUNIV SEJONG IND ACAD COOP FOUD·Filed 2020·Application pending·0 cites
3453US2010006446A1Method for manufacturing package on package with cavitySAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
3551US8821764B2Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the sameJANG MIN-SOK·Filed 2012·Granted Sep 2, 2014·0 cites·14 claims
3651US2015251278A1Solder ball and circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
3751US2019327476A1Video signal processing method and deviceUNIV SEJONG IND ACAD COOP FOUD·Filed 2017·Application pending·0 cites
3851US2015143694A1Carrier for manufacturing printed circuit board and manufacturing method thereof, and method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
3949US8153030B2Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the sameJANG MIN-SOK·Filed 2008·Granted Apr 10, 2012·0 cites·4 claims
4049US2007199735A1Printed circuit board having inner via hole and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
4144US2022272390A1Video signal decoding/encoding method and apparatus thereofUNIV SEJONG IND ACAD COOP FOUD·Filed 2022·Application pending·0 cites
4243US11997255B2Video encoding and decoding using intra block copySK TELECOM CO LTD·Filed 2020·Granted May 28, 2024·0 cites·15 claims
4342US2006180899A1Semiconductive chip device having insulating coating layer and method of manfacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
4439US12120320B2Method for adaptively setting resolution, and image decoding apparatusSK TELECOM CO LTD·Filed 2020·Granted Oct 15, 2024·0 cites·5 claims
4537US2016374196A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
4634US7085580B1Aggregate power measurementLUCENT TECHNOLOGIES INC·Filed 1999·Granted Aug 1, 2006·7 cites·22 claims
4734US2016037645A1Embedded board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
4834US2015342054A1Embedded coreless substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →