Inventor · disambiguated record
Kyowang Koo
Also filed as: KOO KYOWANG
17 granted patents·4 pending applications·46 citations·filing 2016–2024
91Inventor score
Files withSTATS CHIPPAC PTE LTD21
Top patents by PatentIndex Score
21 records- 0195US11935840B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2022·Granted Mar 19, 2024·2 cites·23 claims
- 0295US11444035B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 13, 2022·3 cites·25 claims
- 0395US10784210B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2018·Granted Sep 22, 2020·11 cites·21 claims
- 0493US10985109B2Shielded semiconductor packages with open terminals and methods of making via two-step processSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 20, 2021·10 cites·25 claims
- 0592US11784133B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 10, 2023·2 cites·25 claims
- 0692US11088082B2Semiconductor device with partial EMI shielding and method of making the sameSTATS CHIPPAC PTE LTD·Filed 2018·Granted Aug 10, 2021·7 cites·23 claims
- 0789US10910322B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Feb 2, 2021·4 cites·19 claims
- 0888US9997468B2Integrated circuit packaging system with shielding and method of manufacturing thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 12, 2018·5 cites·20 claims
- 0984US12211804B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2024·Granted Jan 28, 2025·0 cites·25 claims
- 1084US11990421B2Semiconductor device with compartment shield formed from metal bars and manufacturing method thereofSTATS CHIPPAC PTE LTD·Filed 2022·Granted May 21, 2024·2 cites·23 claims
- 1182US12341108B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jun 24, 2025·0 cites·13 claims
- 1269US12308327B2Semiconductor device with compartment shield formed from metal bars and manufacturing method thereofSTATS CHIPPAC PTE LTD·Filed 2024·Granted May 20, 2025·0 cites·22 claims
- 1368US12288753B2Semiconductor device with partial EMI shielding and method of making the sameSTATS CHIPPAC PTE LTD·Filed 2021·Granted Apr 29, 2025·0 cites·18 claims
- 1466US11728281B2Shielded semiconductor packages with open terminals and methods of making via two-step processSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 15, 2023·0 cites·25 claims
- 1558US11145603B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 12, 2021·0 cites·16 claims
- 1658US11024585B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 1756US2024021366A1Electronic components with improved insulation, electronic packages incorporating such electronic componentsSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1854US2024234229A1Method for making a semiconductor device using a double side molding technologySTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1953US12431422B2Semiconductor device and method of forming RDL with graphene-coated coreSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 30, 2025·0 cites·32 claims
- 2051US2024332209A1Method for forming a shielding layer on a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 2146US2023268315A1Method for making semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →