Inventor · disambiguated record
Kyuha Lee
Also filed as: LEE KYUHA
14 granted patents·4 pending applications·20 citations·filing 2016–2024
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18
Top patents by PatentIndex Score
18 records- 0192US12142588B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·1 cites·19 claims
- 0291US11532581B2Semiconductor devices having bonding structures with bonding pads and metal patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 20, 2022·3 cites·20 claims
- 0390US11362067B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0483US2025038141A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0579US11348892B2Semiconductor devices including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·1 cites·19 claims
- 0674US11616036B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·20 claims
- 0768US11296045B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·18 claims
- 0867US12458203B2Cutlery basket and dishwasher comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·19 claims
- 0965US11824035B2Method of manufacturing a semiconductor device including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·18 claims
- 1064USD809726SVacuum cleaner wheelSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 6, 2018·12 cites·1 claims
- 1158US2025127372A1Dish washerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1256US2024274593A1Semiconductor device and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1354US12507862B2DishwasherSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·19 claims
- 1453US2024071841A1Layout method of semiconductor, inspection method of wafer, manufacturing method of the wafer and manufacturing method of multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1552US12500189B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·19 claims
- 1650US11957290B2DishwasherSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·11 claims
- 1750US11658139B2Semiconductor package for improving bonding reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1848US11887841B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →