Inventor · disambiguated record
Kyunghoon Lee
Also filed as: LEE KYUNGHOON
72 granted patents·18 pending applications·342 citations·filing 2008–2025
98Inventor score
Files withLG DISPLAY CO LTD24SAMSUNG ELECTRONICS CO LTD23STATS CHIPPAC LTD11LEE KYUNGHOON8LG ELECTRONICS INC5
Top patents by PatentIndex Score
90 records- 0198US8476115B2Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive materialCHOI DAESIK·Filed 2011·Granted Jul 2, 2013·47 cites·32 claims
- 0297US7906371B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldSTATS CHIPPAC LTD·Filed 2008·Granted Mar 15, 2011·64 cites·24 claims
- 0395US8399300B2Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill materialLEE KYUNGHOON·Filed 2010·Granted Mar 19, 2013·38 cites·27 claims
- 0492US11464076B2Electronic device for reporting communication quality measurement result and method of operating electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·3 cites·11 claims
- 0592US9378983B2Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive materialSTATS CHIPPAC LTD·Filed 2013·Granted Jun 28, 2016·13 cites·30 claims
- 0689US7956449B2Stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 7, 2011·15 cites·17 claims
- 0788US10811919B2BLDC motor and cleaner having the sameLG ELECTRONICS INC·Filed 2016·Granted Oct 20, 2020·5 cites·9 claims
- 0887US10403695B2Organic light-emitting display device and method of manufacturing the sameLG DISPLAY CO LTD·Filed 2017·Granted Sep 3, 2019·5 cites·15 claims
- 0987US9998059B2Motor driving apparatusLG ELECTRONICS INC·Filed 2017·Granted Jun 12, 2018·4 cites·16 claims
- 1087US9898149B2Touch analog front end and touch sensor controller having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 20, 2018·7 cites·18 claims
- 1187US9117812B2Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliabilitySTATS CHIPPAC LTD·Filed 2013·Granted Aug 25, 2015·7 cites·24 claims
- 1287US9030030B2Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill materialSTATS CHIPPAC LTD·Filed 2013·Granted May 12, 2015·8 cites·25 claims
- 1386US10665534B2Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted May 26, 2020·5 cites·18 claims
- 1486US8421201B2Integrated circuit packaging system with underfill and methods of manufacture thereofLEE KYUNGHOON·Filed 2009·Granted Apr 16, 2013·13 cites·16 claims
- 1585US10008555B2Display device and method of manufacturing the sameLG DISPLAY CO LTD·Filed 2017·Granted Jun 26, 2018·5 cites·20 claims
- 1685US9202715B2Integrated circuit packaging system with connection structure and method of manufacture thereofKIM YOUNGCHUL·Filed 2011·Granted Dec 1, 2015·9 cites·10 claims
- 1784US12207487B2Display device comprising a substrate having a first subpixel and a second subpixel and method for manufacturing the sameLG DISPLAY CO LTD·Filed 2024·Granted Jan 21, 2025·0 cites·7 claims
- 1884US8642384B2Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliabilityLEE JAEHYUN·Filed 2012·Granted Feb 4, 2014·6 cites·25 claims
- 1983US9478486B2Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSVSTATS CHIPPAC LTD·Filed 2014·Granted Oct 25, 2016·5 cites·20 claims
- 2083US8786076B2Semiconductor device and method of forming a thermally reinforced semiconductor dieKIM OHHAN·Filed 2011·Granted Jul 22, 2014·7 cites·19 claims
- 2182USD939580SDisplay screen or portion thereof with graphical user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 28, 2021·10 cites·1 claims
- 2281US9913093B2Apparatus and method for measuring positionSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 6, 2018·3 cites·20 claims
- 2380US10186915B2BLDC motor and cleaner having the sameLG ELECTRONICS INC·Filed 2016·Granted Jan 22, 2019·2 cites·20 claims
- 2480US8264059B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldKIM OHHAN·Filed 2011·Granted Sep 11, 2012·4 cites·18 claims
- 2579US9543258B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldSTATS CHIPPAC LTD·Filed 2016·Granted Jan 10, 2017·2 cites·25 claims
- 2679US8723310B2Integrated circuit packaging system having warpage prevention structuresPARK YISU·Filed 2012·Granted May 13, 2014·8 cites·10 claims
- 2778US9899951B2Methods and apparatus for controlling an inverter of a motor driving apparatusLG ELECTRONICS INC·Filed 2016·Granted Feb 20, 2018·2 cites·15 claims
- 2878US8900921B2Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSVKIM SUN MI·Filed 2008·Granted Dec 2, 2014·7 cites·11 claims
- 2978US8877567B2Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor dieLEE KYUNGHOON·Filed 2010·Granted Nov 4, 2014·7 cites·17 claims
- 3077US10536924B2Apparatus and method for positioning terminal in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 14, 2020·3 cites·10 claims
- 3177US10068877B2Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structureSTATS CHIPPAC LTD·Filed 2016·Granted Sep 4, 2018·3 cites·7 claims
- 3276US11917846B2Display device having an oxide insulating film between subpixels and method for manufacturing the sameLG DISPLAY CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·12 claims
- 3376US9390945B2Semiconductor device and method of depositing underfill material with uniform flow rateLEE KYUNGHOON·Filed 2012·Granted Jul 12, 2016·4 cites·26 claims
- 3476US2025275014A1Electronic device for reporting communication quality measurement result and method of operating electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3574US11539902B2Correlated double sampling circuit and image sensor including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 3674US11211438B2Electroluminescent display apparatusLG DISPLAY CO LTD·Filed 2019·Granted Dec 28, 2021·1 cites·20 claims
- 3774US10236467B2Organic light emitting display device and method for manufacturing the sameLG DISPLAY CO LTD·Filed 2017·Granted Mar 19, 2019·2 cites·19 claims
- 3873US11917727B2Electronic device for operating a cellular communication and method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 3972US12512069B2Source printed circuit board and display deviceLG DISPLAY CO LTD·Filed 2024·Granted Dec 30, 2025·0 cites·16 claims
- 4071US10355232B2Organic light emitting display device having bank with bankholeLG DISPLAY CO LTD·Filed 2017·Granted Jul 16, 2019·1 cites·16 claims
- 4171US10051586B2Terminal synchronization method and apparatus for use in wireless communication networkSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 14, 2018·3 cites·17 claims
- 4268US11469390B2Display device and method for manufacturing the sameLG DISPLAY CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·10 claims
- 4368US2025238246A1Automatically executing application routines with user inputsGOOGLE LLC·Filed 2025·Application pending·0 cites
- 4467US12271742B2Automatically executing application routines with user inputsGOOGLE LLC·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 4566US11601992B2Method of accessing network based on access technology and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 4666US8143096B2Integrated circuit package system flip chipPARK SOOMOON·Filed 2008·Granted Mar 27, 2012·4 cites·20 claims
- 4765US9293349B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldKIM OHHAN·Filed 2012·Granted Mar 22, 2016·1 cites·25 claims
- 4864US9230933B2Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structureLEE JAEHYUN·Filed 2011·Granted Jan 5, 2016·2 cites·15 claims
- 4962US11864450B2Display device, and method for manufacturing the sameLG DISPLAY CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·17 claims
- 5062US11147110B2Method of accessing network based on access technology and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 12, 2021·0 cites·20 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kyunghoon Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →