Inventor · disambiguated record
Kyoung-Keun Lee
Also filed as: LEE KYOUNG-KEUN
10 granted patents·3 pending applications·9 citations·filing 2017–2024
81Inventor score
Top patents by PatentIndex Score
13 records- 0190US11355600B2High electron mobility transistors having improved drain current drift and/or leakage current performanceCREE INC·Filed 2021·Granted Jun 7, 2022·2 cites·20 claims
- 0284US10937873B2High electron mobility transistors having improved drain current drift and/or leakage current performanceCREE INC·Filed 2019·Granted Mar 2, 2021·3 cites·21 claims
- 0382US10332817B1Semiconductor die with improved ruggednessCREE INC·Filed 2017·Granted Jun 25, 2019·3 cites·22 claims
- 0471US10886189B2Semiconductor die with improved ruggednessCREE INC·Filed 2019·Granted Jan 5, 2021·1 cites·21 claims
- 0569US11587842B2Semiconductor die with improved ruggednessWOLFSPEED INC·Filed 2020·Granted Feb 21, 2023·0 cites·22 claims
- 0661US12438103B2Transistor including a discontinuous barrier layerWOLFSPEED INC·Filed 2022·Granted Oct 7, 2025·0 cites·43 claims
- 0758US12382699B2Plasma-based barrier layer removal method for increasing peak transconductance while maintaining on-state resistance and related devicesMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Aug 5, 2025·0 cites·28 claims
- 0858US2025374585A1High-electron-mobility transistor having group-iii-nitride capping layer separated from contactMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2024·Application pending·0 cites
- 0956US11869964B2Field effect transistors with modified access regionsWOLFSPEED INC·Filed 2021·Granted Jan 9, 2024·0 cites·28 claims
- 1047US2022384290A1Multilayer encapsulation for humidity robustness and highly accelerated stress tests and related fabrication methodsWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1146US12300564B2Transistor device structure with angled wire bondsWOLFSPEED INC·Filed 2021·Granted May 13, 2025·0 cites·15 claims
- 1246US11658233B2Semiconductors with improved thermal budget and process of making semiconductors with improved thermal budgetCREE INC·Filed 2019·Granted May 23, 2023·0 cites·25 claims
- 1339US2021175138A1Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental ProtectionCREE INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →