Inventor · disambiguated record
Kyeongbin Lim
Also filed as: LIM KYEONGBIN
3 granted patents·14 pending applications·2 citations·filing 2020–2024
51Inventor score
Top patents by PatentIndex Score
17 records- 0178US11837573B2Chip bonding apparatus and method of manufacturing semiconductor device using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·1 cites·12 claims
- 0268US2025249545A1Polishing process apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0367US11443965B2Wafer to wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0456US2025140588A1Die bonding apparatus and die bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0555US2025219011A1Chuck for wafer bonding deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0653US2024282604A1Semiconductor processing apparatus and method of manufacturing semiconductor device using semiconductor processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0753US2024170445A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0852US2025233048A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0951US2025132185A1Cooling system for semiconductor equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1051US2024321805A1Wet atomic layer etching method and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1150US2025070079A1Manufacturing method of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1249US2025054878A1Warpage controlSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1349US2024145416A1Substrate bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1449US2024186282A1Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1547US11581188B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 1644US2023113869A1Substrate transfer apparatusSAMSUNG ELECTRONICS LTD·Filed 2022·Application pending·0 cites
- 1736US2021143030A1Wafer to wafer bonding apparatus, wafer to wafer bonding system, and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →