Inventor · disambiguated record
Kyungdon Mun
Also filed as: MUN KYUNGDON
12 granted patents·13 pending applications·12 citations·filing 2020–2024
84Inventor score
Files withSAMSUNG ELECTRONICS CO LTD25
Top patents by PatentIndex Score
25 records- 0195US11581284B2Semiconductor package with under-bump metal structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·17 claims
- 0293US11626367B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·3 cites·13 claims
- 0392US11569175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·5 cites·20 claims
- 0474US2025062221A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0568US12094817B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0668US12040297B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0766US12119305B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0864US11942434B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·18 claims
- 0961US12482721B2Semiconductor package including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1061US12159826B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·16 claims
- 1160US2025323196A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1259US11342274B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 1359US2025226360A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1459US2025210567A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1558US2025062241A1Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1658US2025201763A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1756US2025015046A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1855US2024321839A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1955US2024332157A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2054US2024032312A1Semiconductor chip stack structure, semiconductor package, and methods of manufacturing themSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2152US2024120280A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2252US2024032310A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2352US2024021579A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2450US11398420B2Semiconductor package having core member and redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 2546US11538737B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →