Inventor · disambiguated record
Kyung Don Mun
Also filed as: MUN KYUNG DON
10 granted patents·19 pending applications·4 citations·filing 2011–2024
80Inventor score
Top patents by PatentIndex Score
29 records- 0190US12261105B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0286US11916002B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 0385US12507424B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 23, 2025·1 cites·20 claims
- 0484US11569158B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0579US12183665B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 0678US2025118646A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0775US2024363573A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0874US12062632B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 0966US11676927B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·19 claims
- 1059US2025349809A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1158US2025343098A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1257US2025132218A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1357US2025233094A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1457US2024332270A1Semiconductor package with decoupling capacitor and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1556US2024355798A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1656US2025062208A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1756US2025046691A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1855US2024178185A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1954US2024178122A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2054US2023422521A1Stack-type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2153US2024145329A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2253US2024120318A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2351US12406929B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 2451US2024072005A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2549US2025087565A1Wiring structure, semiconductor package including the same and manufacturing method for the wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2641US8927880B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 6, 2015·0 cites·8 claims
- 2737US9078344B2Printed circuit board and manufacturing method thereofMUN KYUNG DON·Filed 2012·Granted Jul 7, 2015·0 cites·5 claims
- 2835US2012312591A1Printed Circuit Board and Method of Manufacturing the SameHWANG SUN UK·Filed 2011·Application pending·0 cites
- 2930US2012298412A1Printed circuit board and method of manufacturing the sameMUN KYUNG DON·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →