Inventor · disambiguated record
Kyung-Tae Na
Also filed as: NA KYUNG-TAE
2 granted patents·1 pending application·2 citations·filing 2012–2014
38Inventor score
Top patents by PatentIndex Score
3 records- 0160US8970042B2Circuit board, comprising a core insulation filmSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Mar 3, 2015·1 cites·18 claims
- 0259US9245863B2Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heightsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 26, 2016·1 cites·13 claims
- 0339US2015022985A1Device-embedded package substrate and semiconductor package including the sameNA KYUNG-TAE·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →