Inventor · disambiguated record
Kyung Suk Oh
Also filed as: OH KYUNG S · OH KYUNG SUK
119 granted patents·15 pending applications·651 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
134 records- 0198US11862618B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·9 cites·19 claims
- 0298US9117496B2Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2013·Granted Aug 25, 2015·28 cites·29 claims
- 0397US11211105B2Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2020·Granted Dec 28, 2021·3 cites·20 claims
- 0497US8588280B2Asymmetric communication on shared linksOH KYUNG SUK·Filed 2008·Granted Nov 19, 2013·140 cites·22 claims
- 0597US8451913B2Frequency responsive bus codingOH KYUNG SUK·Filed 2010·Granted May 28, 2013·77 cites·43 claims
- 0697US7486104B2Integrated circuit with graduated on-die terminationRAMBUS INC·Filed 2006·Granted Feb 3, 2009·37 cites·90 claims
- 0796US8610455B2Dynamic on-die termination selectionOH KYUNG SUK·Filed 2011·Granted Dec 17, 2013·12 cites·39 claims
- 0896US8188762B2Controlling dynamic selection of on-die terminationOH KYUNG SUK·Filed 2011·Granted May 29, 2012·11 cites·38 claims
- 0995US10270442B2Memory component with on-die terminationRAMBUS INC·Filed 2018·Granted Apr 23, 2019·7 cites·20 claims
- 1095US10056902B2On-die termination controlRAMBUS INC·Filed 2017·Granted Aug 21, 2018·7 cites·20 claims
- 1195US9935052B1Power line layout in integrated circuitsALTERA CORP·Filed 2014·Granted Apr 3, 2018·21 cites·16 claims
- 1295US8588012B2Balanced on-die terminationWILSON JOHN·Filed 2011·Granted Nov 19, 2013·36 cites·24 claims
- 1394US11018173B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·5 cites·4 claims
- 1494US10861826B2Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 8, 2020·9 cites·8 claims
- 1594US10541201B2Semiconductor package, package-on-package device, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 21, 2020·9 cites·20 claims
- 1694US9337835B2Controlling a flash device having time-multiplexed, on-die-terminated signaling interfaceRAMBUS INC·Filed 2015·Granted May 10, 2016·8 cites·20 claims
- 1794US8610459B2Controlling on-die termination in a dynamic random access memory deviceOH KYUNG SUK·Filed 2012·Granted Dec 17, 2013·9 cites·32 claims
- 1894US7162376B2Circuits, systems and methods for dynamic reference voltage calibrationRAMBUS INC·Filed 2005·Granted Jan 9, 2007·33 cites·7 claims
- 1993US9721629B2On-die termination of address and command signalsRAMBUS INC·Filed 2016·Granted Aug 1, 2017·7 cites·20 claims
- 2093US8548110B2Receiver with clock recovery circuit and adaptive sample and equalizer timingLIN QI·Filed 2007·Granted Oct 1, 2013·21 cites·18 claims
- 2192US11848308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·3 cites·20 claims
- 2292US10854551B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 1, 2020·6 cites·18 claims
- 2392US9660648B2On-die termination controlRAMBUS INC·Filed 2016·Granted May 23, 2017·6 cites·20 claims
- 2491US11783879B2Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2021·Granted Oct 10, 2023·1 cites·20 claims
- 2591US10192598B2Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2017·Granted Jan 29, 2019·4 cites·20 claims
- 2691US9734879B2Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2015·Granted Aug 15, 2017·5 cites·16 claims
- 2790US10770124B2Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2018·Granted Sep 8, 2020·3 cites·18 claims
- 2890US8836384B1Systems and methods for reducing power supply noise or jitterALTERA CORP·Filed 2013·Granted Sep 16, 2014·14 cites·20 claims
- 2990US2025131953A1Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2024·Application pending·0 cites
- 3089US9748934B1Systems and methods for reducing power supply noise or jitterALTERA CORP·Filed 2015·Granted Aug 29, 2017·8 cites·19 claims
- 3189US9455825B2Receiver with clock recovery circuit and adaptive sample and equalizer timingRAMBUS INC·Filed 2015·Granted Sep 27, 2016·5 cites·20 claims
- 3289US9135206B2Command-triggered on-die terminationRAMBUS INC·Filed 2014·Granted Sep 15, 2015·3 cites·20 claims
- 3388US11063791B2Receiver with clock recovery circuit and adaptive sample and equalizer timingRAMBUS INC·Filed 2019·Granted Jul 13, 2021·3 cites·16 claims
- 3488US10756015B2Semiconductor package, package-on-package device, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·4 cites·20 claims
- 3588US9166583B2Buffered memory module having multi-valued on-die terminationRAMBUS INC·Filed 2014·Granted Oct 20, 2015·4 cites·20 claims
- 3687US12249399B2On-die termination of address and command signalsRAMBUS INC·Filed 2024·Granted Mar 11, 2025·0 cites·20 claims
- 3786US12142348B2Memory device comprising programmable command-and-address and/or data interfacesRAMBUS INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 3886US12125766B2Thermoelectric cooling packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 22, 2024·1 cites·20 claims
- 3986US11495576B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 4084US2025132263A1Semiconductor Package And Method Of Fabricating The SameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4183US12002540B2On-die termination of address and command signalsRAMBUS INC·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 4283US11107743B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·3 cites·16 claims
- 4383US7924048B2Memory controller that controls termination in a memory deviceRAMBUS INC·Filed 2010·Granted Apr 12, 2011·3 cites·21 claims
- 4483US7602209B2Controlling memory devices that have on-die terminationRAMBUS INC·Filed 2008·Granted Oct 13, 2009·5 cites·29 claims
- 4582US12395173B2Integrated circuit that applies different data interface terminations during and after write data receptionRAMBUS INC·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 4682US10536304B2Receiver with clock recovery circuit and adaptive sample and equalizer timingRAMBUS INC·Filed 2017·Granted Jan 14, 2020·2 cites·18 claims
- 4782US9225328B2Nonvolatile memory device with time-multiplexed, on-die-terminated signaling interfaceRAMBUS INC·Filed 2015·Granted Dec 29, 2015·2 cites·24 claims
- 4882US8599631B2On-die termination of address and command signalsSHAEFFER IAN P·Filed 2007·Granted Dec 3, 2013·6 cites·22 claims
- 4981US12308363B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 20, 2025·0 cites·19 claims
- 5081US2025226015A1On-Die Termination of Address and Command SignalsRAMBUS INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 134 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →