Inventor · disambiguated record
Kyung Seob Oh
Also filed as: OH KYUNG SEOB
21 granted patents·8 pending applications·92 citations·filing 2007–2020
94Inventor score
Files withSAMSUNG ELECTRO MECH16SAMSUNG ELECTRONICS CO LTD6PARK SEUNG WOOK2SAMSUNG LED CO LTD2KANG JOON SEOK1
Top patents by PatentIndex Score
29 records- 0193US9825003B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 21, 2017·11 cites·14 claims
- 0290US10211149B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 19, 2019·7 cites·20 claims
- 0385US9881873B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 30, 2018·5 cites·13 claims
- 0484US10566289B2Fan-out semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 18, 2020·4 cites·36 claims
- 0584US7598528B2High power light emitting diode package and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 6, 2009·12 cites·7 claims
- 0683US10741461B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·3 cites·8 claims
- 0783US9929100B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 27, 2018·5 cites·22 claims
- 0881US10600748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 24, 2020·3 cites·33 claims
- 0979US9905526B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 27, 2018·3 cites·20 claims
- 1077USD591695SLight-emitting diode moduleSAMSUNG ELECTRO MECH·Filed 2007·Granted May 5, 2009·26 cites·1 claims
- 1176US10170382B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 1, 2019·2 cites·12 claims
- 1271US7846754B2High power light emitting diode package and method of producing the sameSAMSUNG LED CO LTD·Filed 2009·Granted Dec 7, 2010·4 cites·6 claims
- 1370US8582314B2Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structurePARK SEUNG WOOK·Filed 2010·Granted Nov 12, 2013·3 cites·5 claims
- 1468US10224288B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 5, 2019·1 cites·8 claims
- 1567US11011482B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 18, 2021·0 cites·15 claims
- 1665US10154594B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 11, 2018·1 cites·11 claims
- 1760US8957319B2Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 17, 2015·1 cites·15 claims
- 1855US10714437B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 1947US8434918B2Lighting apparatus using light emitting device packageLEE MIN SANG·Filed 2008·Granted May 7, 2013·1 cites·11 claims
- 2047US2012295404A1Method of manufacturing semiconductor packageKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 2145US7935971B2Light emitting diode moduleSAMSUNG LED CO LTD·Filed 2008·Granted May 3, 2011·0 cites·10 claims
- 2245US2011108993A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2345US2013149437A1Method for manufacturing printed circuit boardOH KYUNG SEOB·Filed 2012·Application pending·0 cites
- 2443US10622322B2Fan-out semiconductor package and method of manufacturing the fan-out semiconductorSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 14, 2020·0 cites·12 claims
- 2540US2014186651A1Printed circuit board having copper plated layer with roughness and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2639US2014061864A1Semiconductor substrate having crack preventing structure and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2739US2012084977A1Method of manufacturing block modulePARK SEUNG WOOK·Filed 2011·Application pending·0 cites
- 2837US2018138127A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 2934US2016165723A1Circuit board, package substrate and electronic deviceSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →