Inventor · disambiguated record

Kye Chan Park

Also filed as: PARK KYE CHAN

4 granted patents·90 citations·filing 2001–2003

78Inventor score

Technology areasH10W

Files withDONGBU ELECTRONICS CO LTD4

Top patents by PatentIndex Score

4 records

0184US6441478B2Semiconductor package having metal-pattern bonding and method of fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2001·Granted Aug 27, 2002·54 cites·30 claims
0274US6627979B2Semiconductor package and fabrication method of the sameDONGBU ELECTRONICS CO LTD·Filed 2002·Granted Sep 30, 2003·22 cites·9 claims
0354US6689637B2Method of manufacturing a multi-chip semiconductor packageDONGBU ELECTRONICS CO LTD·Filed 2002·Granted Feb 10, 2004·8 cites·9 claims
0453US6780670B2Semiconductor package and fabrication method of the sameDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Aug 24, 2004·6 cites·11 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →