Inventor · disambiguated record
Kyounghee Park
Also filed as: PARK KYOUNGHEE
26 granted patents·14 pending applications·54 citations·filing 2013–2025
94Inventor score
Files withSTATS CHIPPAC PTE LTD25JCET STATS CHIPPAC KOREA LTD6SAMSUNG DISPLAY CO LTD5JEON DONG JU1JUNG JINHEE1
Top patents by PatentIndex Score
40 records- 0198US11610847B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Mar 21, 2023·7 cites·22 claims
- 0297US11862572B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 2, 2024·4 cites·25 claims
- 0396US11393698B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jul 19, 2022·4 cites·22 claims
- 0494US11990424B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2023·Granted May 21, 2024·2 cites·22 claims
- 0594US11862478B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jan 2, 2024·2 cites·25 claims
- 0692US11088082B2Semiconductor device with partial EMI shielding and method of making the sameSTATS CHIPPAC PTE LTD·Filed 2018·Granted Aug 10, 2021·7 cites·23 claims
- 0792US10804217B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2019·Granted Oct 13, 2020·6 cites·22 claims
- 0891US11616025B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 0990US11664327B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 30, 2023·2 cites·22 claims
- 1090US11342278B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 24, 2022·2 cites·23 claims
- 1188US11355452B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 7, 2022·2 cites·24 claims
- 1288US9997468B2Integrated circuit packaging system with shielding and method of manufacturing thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 12, 2018·5 cites·20 claims
- 1382US12394727B2Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Aug 19, 2025·0 cites·24 claims
- 1480US2025023227A1Antenna-in-Package Devices and Methods of MakingSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1579US12266615B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·23 claims
- 1676US11715703B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 1, 2023·0 cites·23 claims
- 1775US2025201729A1Selective EMI Shielding Using Preformed Mask with Fang DesignSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1873US12136759B2Antenna-in-package devices and methods of makingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 5, 2024·0 cites·23 claims
- 1970US11688697B2Emi shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 27, 2023·0 cites·21 claims
- 2069US9210816B1Method of manufacture of support system with fine pitchROH YOUNGDAL·Filed 2013·Granted Dec 8, 2015·2 cites·20 claims
- 2168US12288753B2Semiconductor device with partial EMI shielding and method of making the sameSTATS CHIPPAC PTE LTD·Filed 2021·Granted Apr 29, 2025·0 cites·18 claims
- 2266US9171795B2Integrated circuit packaging system with embedded component and method of manufacture thereofJEON DONG JU·Filed 2014·Granted Oct 27, 2015·2 cites·20 claims
- 2365US10134664B2Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 20, 2018·1 cites·20 claims
- 2462US2025221267A1Display device and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 2560US9607938B2Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereofKANG MINKYUNG·Filed 2013·Granted Mar 28, 2017·2 cites·20 claims
- 2659US8975665B2Integrated circuit packaging system with coreless substrate and method of manufacture thereofJUNG JINHEE·Filed 2013·Granted Mar 10, 2015·2 cites·20 claims
- 2758US11145603B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 12, 2021·0 cites·16 claims
- 2858US11024585B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 2957US2025038059A1Modular interconnection unit, semiconductor package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3056US2024347509A1Semiconductor package strip and method for forming a semiconductor deviceJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3155US2023411305A1Method for selectively forming a shielding layer on a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 3255US2024237224A9Method of manufacturing electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 3355US2024040904A1Display device, method for manufacturing display device, and apparatus for manufacturing display deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 3454US2024351328A1Light irradiation module and printing device including the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 3554US2025081807A1Display apparatus and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 3653US2025201733A1Semiconductor Device and Method of Forming Protective Layer on Substrate to Avoid Damage During EncapsulationJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 3752US11594438B2Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 28, 2023·0 cites·21 claims
- 3852US2024120268A1Method for forming a shielding layer on a semiconductor deviceJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 3950US2025309136A1Shielded conductive device, a method for forming the same and an electronic package assemblyJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 4048US2024098907A1Electronic package and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →