Inventor · disambiguated record
Kyounglim Suk
Also filed as: SUK KYOUNGLIM
7 granted patents·14 pending applications·0 citations·filing 2021–2025
69Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD21
Top patents by PatentIndex Score
21 records- 0175US2025343196A1Semiconductor package including redistribution substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0267US12068302B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0364US12388040B2Semiconductor package including redistribution substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·19 claims
- 0464US12040264B2Semiconductor package including under bump metallization padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·13 claims
- 0564US2025167084A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0662US12237250B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 0761US2025183216A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0860US2025079249A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0956US2025029906A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1055US11670629B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 1155US2024312974A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1255US2024186231A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1355US2024321839A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1454US2024096773A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1553US2024071894A1Packaged integrated circuit having enhanced electrical interconnects thereinSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1652US2024065003A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1751US12009274B2Semiconductor package including thermal exhaust pathwaySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·19 claims
- 1850US11955499B2Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distanceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 1950US2024145396A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2048US2024047324A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2147US2023071812A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →