Inventor · disambiguated record
Kyoung Lim Suk
Also filed as: SUK KYOUNG LIM
34 granted patents·21 pending applications·56 citations·filing 2011–2025
95Inventor score
Top patents by PatentIndex Score
55 records- 0197US11626393B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·4 cites·19 claims
- 0296US11610785B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·4 cites·20 claims
- 0394US11869775B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 9, 2024·2 cites·20 claims
- 0492US12170251B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 17, 2024·2 cites·20 claims
- 0592US11810915B2Semiconductor package with redistribution substrate having embedded passive deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·2 cites·20 claims
- 0692US11152309B2Semiconductor package, method of fabricating semiconductor package, and method of fabricating redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·9 cites·16 claims
- 0791US10930625B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·5 cites·19 claims
- 0891US10522471B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·7 cites·23 claims
- 0989US11348876B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 1085US11605584B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 14, 2023·1 cites·20 claims
- 1185US10622320B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·4 cites·9 claims
- 1282US2024332268A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1381US10879292B2Semiconductor package and method of manufacturing the sameJANG JAEGWON·Filed 2019·Granted Dec 29, 2020·4 cites·20 claims
- 1480US12009350B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·19 claims
- 1580US10741518B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 11, 2020·2 cites·20 claims
- 1679US11107700B2Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·2 cites·19 claims
- 1777US12237256B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1876US2025336839A1Redistribution substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1976US2025070038A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2075US10879187B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 29, 2020·2 cites·18 claims
- 2175US8486318B2Fiber, fiber aggregate and adhesive having the sameKIM DEOK HOON·Filed 2011·Granted Jul 16, 2013·2 cites·19 claims
- 2274US12394700B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 2373US2024312886A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2473US2025167098A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2572US10964643B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 2671US2024021608A1Semiconductor package with redistribution substrate having embedded passive deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2770US12381156B2Redistribution substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 2870US10546829B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 28, 2020·1 cites·20 claims
- 2968US2024170408A1Semiconductor package with stepped redistribution structure exposing mold layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3067US12015018B2Semiconductor package with multiple redistribution substratesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·9 claims
- 3166US2025192016A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3265US11018108B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·0 cites·20 claims
- 3363US12261106B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·19 claims
- 3463US12014975B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 3562US11804427B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·11 claims
- 3661US12453204B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 21, 2025·0 cites·17 claims
- 3761US11538798B2Semiconductor package with multiple redistribution substratesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·18 claims
- 3861US2021375642A1Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 3959US11887931B2Semiconductor package with stepped redistribution structure exposing mold layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 4059US11101231B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 4158US11694936B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 4257US12494412B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·19 claims
- 4357US12288780B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·33 claims
- 4457US2024178114A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4557US2024243053A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4657US2024332270A1Semiconductor package with decoupling capacitor and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4756US2024355798A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4856US2025062208A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4955US2024178185A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 5055US2025022788A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kyoung Lim Suk files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →