Inventor · disambiguated record
Kyousuke Sutou
Also filed as: SUTOU Kyousuke
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Files withRESONAC CORP2
Top patents by PatentIndex Score
2 records- 0172US2025277111A1Resin composition, prepreg, laminated plate, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 0254US2025287499A1Prepreg, laminated plate, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →