Inventor · disambiguated record
Lawrence J. Charneski
Also filed as: CHARNESKI LAWRENCE J
28 granted patents·3 pending applications·581 citations·filing 1996–2007
97Inventor score
Top patents by PatentIndex Score
31 records- 0194US5939334ASystem and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxidesSHARP LAB OF AMERICA INC·Filed 1997·Granted Aug 17, 1999·126 cites·9 claims
- 0286US7098101B1Method of forming PrxCa1−xMnO3 thin films having a PrMnO3/CaMnO3 super lattice structure using metalorganic chemical vapor depositionSHARP LAB OF AMERICA INC·Filed 2005·Granted Aug 29, 2006·14 cites·18 claims
- 0381US5744192AMethod of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVSSHARP MICROELECT TECH INC·Filed 1996·Granted Apr 28, 1998·54 cites·26 claims
- 0476US6972239B1Low temperature MOCVD processes for fabrication of PrXCa1-xMnO3 thin filmsSHARP LAB OF AMERICA INC·Filed 2004·Granted Dec 6, 2005·13 cites·10 claims
- 0576US6596344B2Method of depositing a high-adhesive copper thin film on a metal nitride substrateSHARP LAB OF AMERICA INC·Filed 2001·Granted Jul 22, 2003·16 cites·6 claims
- 0676US5948467AEnhanced CVD copper adhesion by two-step deposition processSHARP LAB OF AMERICA INC·Filed 1998·Granted Sep 7, 1999·50 cites·10 claims
- 0776US5913144AOxidized diffusion barrier surface for the adherence of copper and method for sameSHARP MICROELECT TECH INC·Filed 1996·Granted Jun 15, 1999·53 cites·10 claims
- 0875US6281377B1Substituted cycloalkene new copper precursors for chemical vapor deposition of copper metal thin filmsSHARP LAB OF AMERICA INC·Filed 2000·Granted Aug 28, 2001·8 cites·8 claims
- 0975US5767301APrecursor with (alkyloxy)(alkyl)-silylolefin ligand to deposit copperSHARP MICROELECT TECH INC·Filed 1997·Granted Jun 16, 1998·40 cites·29 claims
- 1073US6090960APrecursor with (methoxy) (methyl) silylolefin ligand to deposit copper and method sameSHARP LAB OF AMERICA INC·Filed 1997·Granted Jul 18, 2000·16 cites·30 claims
- 1170US7759150B2Nanorod sensor with single-plane electrodesSHARP LAB OF AMERICA INC·Filed 2007·Granted Jul 20, 2010·4 cites·14 claims
- 1266US7696550B2Bipolar switching PCMO capacitorSHARP LAB OF AMERICA INC·Filed 2007·Granted Apr 13, 2010·2 cites·16 claims
- 1366US7235407B2System and method for forming a bipolar switching PCMO filmSHARP LAB OF AMERICA INC·Filed 2004·Granted Jun 26, 2007·7 cites·21 claims
- 1464US6284652B1Adhesion promotion method for electro-chemical copper metallization in IC applicationsADVANCED TECH MATERIALS·Filed 1998·Granted Sep 4, 2001·35 cites·26 claims
- 1563US5909637ACopper adhesion to a diffusion barrier surface and method for sameSHARP MICROELECT TECH INC·Filed 1996·Granted Jun 1, 1999·24 cites·12 claims
- 1660US6555916B2Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxidesSHARP LAB OF AMERICA INC·Filed 2001·Granted Apr 29, 2003·5 cites·8 claims
- 1759US6764537B2Copper metal precursorSHARP LAB OF AMERICA INC·Filed 2003·Granted Jul 20, 2004·5 cites·3 claims
- 1859US5851367ADifferential copper deposition on integrated circuit surfaces and method for sameSHARP MICROELECT TECH INC·Filed 1996·Granted Dec 22, 1998·20 cites·17 claims
- 1958US6645860B2Adhesion promotion method for CVD copper metallization in IC applicationsADVANCED TECH MATERIALS·Filed 2001·Granted Nov 11, 2003·7 cites·13 claims
- 2056US5994571ASubstituted ethylene precursor and synthesis methodSHARP LAB OF AMERICA INC·Filed 1998·Granted Nov 30, 1999·17 cites·19 claims
- 2150US6355562B1Adhesion promotion method for CVD copper metallization in IC applicationsADVANCED TECH MATERIALS·Filed 1998·Granted Mar 12, 2002·13 cites·16 claims
- 2248US6284052B2In-situ method of cleaning a metal-organic chemical vapor deposition chamberSHARP LAB OF AMERICA INC·Filed 1998·Granted Sep 4, 2001·12 cites·21 claims
- 2346US6669870B2Substituted phenylethylene precursor synthesis methodSHARP LAB OF AMERICA INC·Filed 2001·Granted Dec 30, 2003·0 cites·2 claims
- 2446US6281589B1System of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxidesSHARP LAB OF AMERICA INC·Filed 1999·Granted Aug 28, 2001·9 cites·11 claims
- 2546US2006068099A1Grading PrxCa1-xMnO3 thin films by metalorganic chemical vapor depositionSHARP LAB OF AMERICA INC·Filed 2004·Application pending·0 cites
- 2645US6245261B1Substituted phenylethylene precursor and synthesis methodSHARP LAB OF AMERICA INC·Filed 1998·Granted Jun 12, 2001·8 cites·6 claims
- 2745US6002176ADifferential copper deposition on integrated circuit surfacesSHARP LAB OF AMERICA INC·Filed 1998·Granted Dec 14, 1999·10 cites·11 claims
- 2844US6218734B1Copper adhered to a diffusion barrier surfaceSHARP LAB OF AMERICA INC·Filed 1999·Granted Apr 17, 2001·9 cites·3 claims
- 2944US2007048990A1Method of buffer layer formation for RRAM thin film depositionSHARP LAB OF AMERICA INC·Filed 2005·Application pending·0 cites
- 3035US6204176B1Substituted phenylethylene precursor deposition methodSHARP LAB OF AMERICA INC·Filed 1999·Granted Mar 20, 2001·4 cites·12 claims
- 3133US2004170761A1Precursor solution and method for controlling the composition of MOCVD deposited PCMOSHARP LAB OF AMERICA INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →