Inventor · disambiguated record
Lai Wei Chih
Also filed as: CHIH LAI C · CHIH LAI WEI
13 granted patents·2 pending applications·65 citations·filing 2004–2025
89Inventor score
Top patents by PatentIndex Score
15 records- 0196US9431369B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 30, 2016·29 cites·15 claims
- 0294US9337073B23D shielding case and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 10, 2016·17 cites·20 claims
- 0393US9252491B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 2, 2016·11 cites·20 claims
- 0484US10270172B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·3 cites·20 claims
- 0582US11050153B2Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·2 cites·20 claims
- 0678US10504751B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 0778US2025357367A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0874US11984668B2Method of embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 0971US11532868B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 1064US10032651B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 24, 2018·1 cites·20 claims
- 1157US10622701B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 1254US9985336B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·0 cites·20 claims
- 1352US10276401B23D shielding case and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·19 claims
- 1445US9391350B2RF choke device for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 12, 2016·0 cites·20 claims
- 1539US2006076386A1End cap assembly for a nailerBASSO INDUSRY CORP·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Lai Wei Chih files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →