Inventor · disambiguated record
Lawrence H. Herko
Also filed as: HERKO LAWRENCE H
8 granted patents·234 citations·filing 1992–2000
89Inventor score
Files withXEROX CORP8
Top patents by PatentIndex Score
8 records- 0185US5494698ATeflon filled resinoid dicing blades for fabricating silicon die modulesXEROX CORP·Filed 1994·Granted Feb 27, 1996·55 cites·3 claims
- 0285US5408739ATwo-step dieing process to form an ink jet faceXEROX CORP·Filed 1993·Granted Apr 25, 1995·49 cites·15 claims
- 0378US5668061AMethod of back cutting silicon wafers during a dicing procedureXEROX CORP·Filed 1995·Granted Sep 16, 1997·49 cites·6 claims
- 0471US6436793B1Methods of forming semiconductor structureXEROX CORP·Filed 2000·Granted Aug 20, 2002·17 cites·30 claims
- 0562US5306370AMethod of reducing chipping and contamination of reservoirs and channels in thermal ink printheads during dicing by vacuum impregnation with protective filler materialXEROX CORP·Filed 1992·Granted Apr 26, 1994·32 cites·7 claims
- 0658US5515089AInk jet printhead with sealed manifold and printhead dieXEROX CORP·Filed 1992·Granted May 7, 1996·15 cites·27 claims
- 0743US5506610ABack side relief on thermal ink jet die assemblyXEROX CORP·Filed 1995·Granted Apr 9, 1996·7 cites·4 claims
- 0841US5637388ALayered resinoid/diamond blade for precision cutting operations and method of manufacturing sameXEROX CORP·Filed 1995·Granted Jun 10, 1997·10 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →