Inventor · disambiguated record
Lance C. Hibbeler
Also filed as: HIBBELER LANCE C
1 granted patent·2 pending applications·3 citations·filing 2018–2022
21Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0180US10720345B1Wafer to wafer bonding with low wafer distortionINTEL CORP·Filed 2018·Granted Jul 21, 2020·3 cites·13 claims
- 0251US2023367204A1System and method for reducing pellicle ruptureINTEL CORP·Filed 2022·Application pending·0 cites
- 0350US2024063143A1Device, method, and system to mitigate warpage of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →