Inventor · disambiguated record
Larry L. Jordan
Also filed as: JORDAN LARRY L · JORDAN LARRY LEE
5 granted patents·2 pending applications·261 citations·filing 1975–2006
83Inventor score
Top patents by PatentIndex Score
7 records- 0194US6062461AProcess for bonding micromachined wafers using solderDELPHI TECH INC·Filed 1998·Granted May 16, 2000·196 cites·17 claims
- 0271US6537892B2Glass frit wafer bonding process and packages formed therebyDELPHI TECH INC·Filed 2001·Granted Mar 25, 2003·17 cites·18 claims
- 0363US5989372ASol-gel bonding solution for anodic bondingHUGHES ELECTRONICS CORP·Filed 1998·Granted Nov 23, 1999·33 cites·23 claims
- 0451US6879048B2Glass frit wafer bonding process and packages formed therebyDELPHI TECH INC·Filed 2003·Granted Apr 12, 2005·4 cites·10 claims
- 0540US4004955APositive selective nickel alignment systemGEN MOTORS CORP·Filed 1975·Granted Jan 25, 1977·11 cites·2 claims
- 0639US2008131662A1Alignment of a cap to a MEMS waferJORDAN LARRY L·Filed 2006·Application pending·0 cites
- 0736US2006214266A1Bevel dicing semiconductor componentsJORDAN LARRY L·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →