Inventor · disambiguated record
Larry D. Kinsman
Also filed as: KINSMAN LARRY · KINSMAN LARRY D · KINSMAN LARRY DUANE
231 granted patents·17 pending applications·8,592 citations·filing 1989–2024
99Inventor score
Files withMICRON TECHNOLOGY INC205SEMICONDUCTOR COMPONENTS IND LLC15ORIN TECH LLC8KINSMAN LARRY D7APTINA IMAGING CORP1
Top patents by PatentIndex Score
248 records- 0199US6885107B2Flip-chip image sensor packages and methods of fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 26, 2005·284 cites·8 claims
- 0299US6294839B1Apparatus and methods of packaging and testing dieMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·352 cites·16 claims
- 0398US6934065B2Microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 23, 2005·162 cites·45 claims
- 0498US6797616B2Circuit boards containing vias and methods for producing sameMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 28, 2004·175 cites·22 claims
- 0598US6774486B2Circuit boards containing vias and methods for producing sameMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 10, 2004·176 cites·29 claims
- 0698US6717245B1Chip scale packages performed by wafer level processingMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 6, 2004·170 cites·25 claims
- 0798US6563712B2Heak sink chip packageMICRON TECHNOLOGY INC·Filed 2002·Granted May 13, 2003·154 cites·21 claims
- 0898US6297960B1Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·155 cites·34 claims
- 0998US6297548B1Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·259 cites·46 claims
- 1098US6291894B1Method and apparatus for a semiconductor package for vertical surface mountingMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 18, 2001·293 cites·5 claims
- 1198US6172419B1Low profile ball grid array packageMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 9, 2001·323 cites·26 claims
- 1298US6159764AVaried-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packagesMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 12, 2000·283 cites·1 claims
- 1398US6122171AHeat sink chip package and method of makingMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 19, 2000·311 cites·26 claims
- 1498US5107328APackaging means for a semiconductor die having particular shelf structureMICRON TECHNOLOGY INC·Filed 1991·Granted Apr 21, 1992·291 cites·20 claims
- 1597US7638813B2Methods of fabrication for flip-chip image sensor packagesMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 29, 2009·33 cites·28 claims
- 1697US7122390B2Methods of fabrication for flip-chip image sensor packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 17, 2006·35 cites·13 claims
- 1797US6833612B2Flip-chip image sensor packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 21, 2004·88 cites·11 claims
- 1897US6153924AMultilayered lead frame for semiconductor packageMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 28, 2000·223 cites·31 claims
- 1996US6780746B2Method for fabricating a chip scale package using wafer level processing and devices resulting therefromMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 24, 2004·88 cites·18 claims
- 2096US6744137B2Bumped die and wire bonded board-on-chip packageMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 1, 2004·77 cites·54 claims
- 2196US6709893B2Interconnections for a semiconductor device and method for forming sameMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 23, 2004·94 cites·25 claims
- 2296US6215175B1Semiconductor package having metal foil die mounting plateMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 10, 2001·180 cites·29 claims
- 2396US5696033AMethod for packaging a semiconductor dieMICRON TECHNOLOGY INC·Filed 1995·Granted Dec 9, 1997·193 cites·31 claims
- 2495US9561530B1Method for the in situ remediation of contaminantsORIN TECH LLC·Filed 2015·Granted Feb 7, 2017·31 cites·21 claims
- 2595US6760224B2Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 6, 2004·60 cites·19 claims
- 2695US6563217B2Module assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2002·Granted May 13, 2003·76 cites·26 claims
- 2795US6493229B2Heat sink chip packageMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 10, 2002·76 cites·22 claims
- 2895US5302891ADiscrete die burn-in for non-packaged dieMICRON TECHNOLOGY INC·Filed 1992·Granted Apr 12, 1994·224 cites·43 claims
- 2994US9878301B1Method and composition for the remediation of contaminantsORIN TECH LLC·Filed 2016·Granted Jan 30, 2018·17 cites·25 claims
- 3094US7183191B2Method for fabricating a chip scale package using wafer level processingMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 27, 2007·24 cites·4 claims
- 3194US6414374B2Semiconductor device including edge bond pads and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 2, 2002·62 cites·18 claims
- 3294US6215177B1Tape under frame for conventional-type IC package assemblyMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 10, 2001·49 cites·60 claims
- 3394US5995378ASemiconductor device socket, assembly and methodsMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 30, 1999·57 cites·42 claims
- 3493US6528408B2Method for bumped die and wire bonded board-on-chip packageMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 4, 2003·52 cites·25 claims
- 3593US6091251ADiscrete die burn-in for nonpackaged dieFiled 1997·Granted Jul 18, 2000·125 cites·10 claims
- 3692US7829991B2Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 9, 2010·17 cites·18 claims
- 3792US7321455B2Microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 22, 2008·22 cites·25 claims
- 3892US6940141B2Flip-chip image sensor packages and methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 6, 2005·38 cites·10 claims
- 3992US6414391B1Module assembly for stacked BGA packages with a common bus bar in the assemblyMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 2, 2002·87 cites·23 claims
- 4092US6246110B1Downset lead frame for semiconductor packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 12, 2001·119 cites·18 claims
- 4192US5697825AMethod for evacuating and sealing field emission displaysMICRON DISPLAY TECH INC·Filed 1995·Granted Dec 16, 1997·64 cites·52 claims
- 4292US5155067APackaging for a semiconductor dieMICRON TECHNOLOGY INC·Filed 1991·Granted Oct 13, 1992·106 cites·9 claims
- 4391US6964886B2Methods of fabrication for flip-chip image sensor packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 15, 2005·37 cites·11 claims
- 4491US6525943B2Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 25, 2003·36 cites·32 claims
- 4591US6426875B1Heat sink chip packageMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 30, 2002·46 cites·13 claims
- 4691US6133068AIncreasing the gap between a lead frame and a semiconductor dieMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 17, 2000·100 cites·11 claims
- 4791US6088237ASemiconductor device socket, assembly and methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 11, 2000·43 cites·62 claims
- 4891US5997378AMethod for evacuating and sealing field emission displaysMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 7, 1999·51 cites·22 claims
- 4990US9754983B1Chip scale package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Sep 5, 2017·6 cites·4 claims
- 5090US7408255B2Assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 5, 2008·12 cites·19 claims
Showing the top 50 of 248 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →