Inventor · disambiguated record
Lay Hong Lee
Also filed as: LEE LAY HONG
2 granted patents·1 pending application·2 citations·filing 2005–2013
36Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0143US8586413B2Multi-chip module having a support structure and method of manufactureFOONG YIN LYE·Filed 2005·Granted Nov 19, 2013·2 cites·19 claims
- 0237US2014061895A1Multi-Chip Module and Method of ManufactureSPANSION LLC·Filed 2013·Application pending·0 cites
- 0326US9165795B2High performance low profile QFN/LGATAN GIN GHEE·Filed 2010·Granted Oct 20, 2015·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →